Inventor
Dittes Marc
DE10 patents
⚠️ This page may combine multiple inventors who share the name “Dittes Marc”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL IP CORP
7 patentsUS10403609B2Sep 3, 2019
System-in-package devices and methods for forming system-in-package devices
INTEL IP CORP7 citations84
US10522485B2Dec 31, 2019
Electrical device and a method for forming an electrical device
INTEL IP CORP3 citations73
US10209466B2Feb 19, 2019
Integrated circuit packages including an optical redistribution layer
INTEL IP CORP3 citations73
US10553538B2Feb 4, 2020
Semiconductor package having a variable redistribution layer thickness
INTEL IP CORP2 citations70
US10115668B2Oct 30, 2018
Semiconductor package having a variable redistribution layer thickness
INTEL IP CORP5 citations70
US10490527B2Nov 26, 2019
Vertical wire connections for integrated circuit package
INTEL IP CORP1 citations62
US10816742B2Oct 27, 2020
Integrated circuit packages including an optical redistribution layer
INTEL IP CORP0 citations52