Inventor
YAJIMA MELANIE S
US9 patents
⚠️ This page may combine multiple inventors who share the name “YAJIMA MELANIE S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HRL LAB LLC
8 patentsUS9385083B1Jul 5, 2016
Wafer-level die to package and die to die interconnects suspended over integrated heat sinks
HRL LAB LLC52 citations97
US9508652B1Nov 29, 2016
Direct IC-to-package wafer level packaging with integrated thermal heat spreaders
HRL LAB LLC25 citations93
US9337124B1May 10, 2016
Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers
HRL LAB LLC34 citations93
US9837372B1Dec 5, 2017
Wafer-level die to package and die to die interconnects suspended over integrated heat sinks
HRL LAB LLC16 citations92
US9825116B1Nov 21, 2017
Formation of high-resolution patterns inside deep cavities and applications to RF SI-embedded inductors
HRL LAB LLC5 citations83
US10388454B1Aug 20, 2019
Laminated conductors
HRL LAB LLC0 citations51
US10062505B1Aug 28, 2018
Laminated conductors
HRL LAB LLC1 citations51
US10032851B1Jul 24, 2018
Formation of high-resolution patterns inside deep cavities and applications to RF Si-embedded inductors
HRL LAB LLC0 citations51