Inventor
CHIANG MENG-WEI
TW3 patents
Patents
3 patentsUS12223250B2Feb 11, 2025
Method of manufacturing integrated circuit having through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11748544B2Sep 5, 2023
Method of manufacturing integrated circuit having through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11080455B1Aug 3, 2021
Layout design of integrated circuit with through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71