Inventor
LEE SANG S
US25 patents
⚠️ This page may combine multiple inventors who share the name “LEE SANG S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VLSI TECHNOLOGY INC
15 patentsUS5332864AJul 26, 1994
Integrated circuit package having an interposer
VLSI TECHNOLOGY INC302 citations97
US5441684AAug 15, 1995
Method of forming molded plastic packages with integrated heat sinks
VLSI TECHNOLOGY INC68 citations96
US5430331AJul 4, 1995
Plastic encapsulated integrated circuit package having an embedded thermal dissipator
VLSI TECHNOLOGY INC80 citations96
US5379187AJan 3, 1995
Design for encapsulation of thermally enhanced integrated circuits
VLSI TECHNOLOGY INC137 citations96
US5359227AOct 25, 1994
Lead frame assembly and method for wiring same
VLSI TECHNOLOGY INC47 citations96
US5598031AJan 28, 1997
Electrically and thermally enhanced package using a separate silicon substrate
VLSI TECHNOLOGY INC81 citations94
US5964030AOct 12, 1999
Mold flow regulating dam ring
VLSI TECHNOLOGY INC50 citations92
US5296744AMar 22, 1994
Lead frame assembly and method for wiring same
VLSI TECHNOLOGY INC23 citations92
US5825623AOct 20, 1998
Packaging assemblies for encapsulated integrated circuit devices
VLSI TECHNOLOGY INC23 citations89
US5625225AApr 29, 1997
Multi-layered, integrated circuit package having reduced parasitic noise characteristics
VLSI TECHNOLOGY INC37 citations89
US5839184ANov 24, 1998
Method for creating on-package inductors for use with integrated circuits
VLSI TECHNOLOGY INC34 citations86
US5448825ASep 12, 1995
Method of making electrically and thermally enhanced integrated-circuit package
VLSI TECHNOLOGY INC8 citations73
US5331511AJul 19, 1994
Electrically and thermally enhanced integrated-circuit package
VLSI TECHNOLOGY INC7 citations73
US5641988AJun 24, 1997
Multi-layered, integrated circuit package having reduced parasitic noise characteristics
VLSI TECHNOLOGY INC14 citations71
US5924190AJul 20, 1999
Methods and apparatus for manufacturing encapsulated integrated circuits
VLSI TECHNOLOGY INC10 citations70
SAMSUNG ELECTRONICS CO LTD
4 patentsUS5510573AApr 23, 1996
Method for controlling a muscial medley function in a karaoke television
SAMSUNG ELECTRONICS CO LTD69 citations93
US5572263ANov 5, 1996
Video signal selection circuit
SAMSUNG ELECTRONICS CO LTD43 citations89
US5486645AJan 23, 1996
Musical medley function controlling method in a televison with a video/accompaniment-music player
SAMSUNG ELECTRONICS CO LTD51 citations87
US5237443AAug 17, 1993
Fine adjustment tuning apparatus for TV and a method of storing tuning data
SAMSUNG ELECTRONICS CO LTD20 citations79