Inventor
KIM DONG-KUK
KR25 patents
⚠️ This page may combine multiple inventors who share the name “KIM DONG-KUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
10 patentsUS7298032B2Nov 20, 2007
Semiconductor multi-chip package and fabrication method
SAMSUNG ELECTRONICS CO LTD58 citations95
US6742561B2Jun 1, 2004
Apparatus for die bonding
SAMSUNG ELECTRONICS CO LTD48 citations92
US7294531B2Nov 13, 2007
Wafer level chip stack method
SAMSUNG ELECTRONICS CO LTD44 citations91
US7051428B2May 30, 2006
In line system used in a semiconductor package assembling
SAMSUNG ELECTRONICS CO LTD18 citations83
US6662799B2Dec 16, 2003
Vertical wafer sawing apparatus
SAMSUNG ELECTRONICS CO LTD7 citations70
US7374966B2May 20, 2008
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
SAMSUNG ELECTRONICS CO LTD5 citations69
US6620028B2Sep 16, 2003
Apparatus for cutting a wafer
SAMSUNG ELECTRONICS CO LTD2 citations62
US7096914B2Aug 29, 2006
Apparatus for bonding a chip using an insulating adhesive tape
SAMSUNG ELECTRONICS CO LTD6 citations61
US7135353B2Nov 14, 2006
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
SAMSUNG ELECTRONICS CO LTD5 citations58
US6923077B2Aug 2, 2005
Apparatus and method for wafer backside inspection
SAMSUNG ELECTRONICS CO LTD4 citations56
DAEWOO ELECTRONICS CO LTD
9 patentsUS5760947AJun 2, 1998
Thin film actuated mirror array for use in an optical projection system and method for the manufacture thereof
DAEWOO ELECTRONICS CO LTD31 citations92
US5636070AJun 3, 1997
Thin film actuated mirror array
DAEWOO ELECTRONICS CO LTD47 citations92
US5758396AJun 2, 1998
Method of manufacturing a piezoelectric actuator array
DAEWOO ELECTRONICS CO LTD35 citations91
US5608569AMar 4, 1997
Method for manufacturing an array of thin film actuated mirrors
DAEWOO ELECTRONICS CO LTD8 citations74
US5505807AApr 9, 1996
Actuated mirror array and method for the fabricating thereof
DAEWOO ELECTRONICS CO LTD11 citations74
US5936757AAug 10, 1999
Thin film actuated mirror array
DAEWOO ELECTRONICS CO LTD13 citations73
US5900998AMay 4, 1999
Thin film actuated mirror array and method for the manufacture thereof
DAEWOO ELECTRONICS CO LTD7 citations73
US5841569ANov 24, 1998
Method of manufacturing an array of thin film actuated mirrors
DAEWOO ELECTRONICS CO LTD3 citations63
US5606451AFeb 25, 1997
Electrodisplacive actuator array and method for the manufacture thereof
DAEWOO ELECTRONICS CO LTD3 citations54
SAMSUNG ELECTRO MECH
5 patentsUS7082679B2Aug 1, 2006
Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof
SAMSUNG ELECTRO MECH17 citations92
US7346982B2Mar 25, 2008
Method of fabricating printed circuit board having thin core layer
SAMSUNG ELECTRO MECH26 citations91
US7453045B2Nov 18, 2008
Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof
SAMSUNG ELECTRO MECH12 citations83
US7347950B2Mar 25, 2008
Rigid flexible printed circuit board and method of fabricating same
SAMSUNG ELECTRO MECH14 citations79
US7679928B2Mar 16, 2010
System-in-package module and mobile terminal having the same
SAMSUNG ELECTRO MECH2 citations58