Inventor
KULINSKY LAWRENCE
US13 patents
⚠️ This page may combine multiple inventors who share the name “KULINSKY LAWRENCE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIV CALIFORNIA
9 patentsUS11001002B2May 11, 2021
Powder bed additive manufacturing method of fabricating a porous matrix
UNIV CALIFORNIA5 citations71
US10166541B2Jan 1, 2019
Centrifugal microfluidic platform for automated media exchange
UNIV CALIFORNIA2 citations69
US10799952B2Oct 13, 2020
Selective laser sintering using functional inclusions dispersed in the matrix material being created
UNIV CALIFORNIA3 citations64
US11840769B2Dec 12, 2023
Guided template based electrokinetic microassembly (TEA)
UNIV CALIFORNIA0 citations60
US11534832B2Dec 27, 2022
Selective laser sintering using functional inclusions dispersed in the matrix material being created
UNIV CALIFORNIA0 citations53
US10245614B2Apr 2, 2019
Imprinter for conformal coating of three-dimensional surfaces
UNIV CALIFORNIA0 citations51
US11912900B2Feb 27, 2024
Step-wise fabrication of conductive carbon nanotube bridges via dielectrophoresis
UNIV CALIFORNIA0 citations50
US11142738B2Oct 12, 2021
Sieve system and methods for cell media exchange
UNIV CALIFORNIA0 citations50
US9353455B2May 31, 2016
Dielectrophoresis and electrodeposition process for selective particle entrapment
UNIV CALIFORNIA1 citations44
INT RECTIFIER CORP
3 patentsUS7525178B2Apr 28, 2009
Semiconductor device with capacitively coupled field plate
INT RECTIFIER CORP14 citations82
US6768211B2Jul 27, 2004
Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging
INT RECTIFIER CORP3 citations60
US6621166B2Sep 16, 2003
Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging
INT RECTIFIER CORP2 citations60