Inventor
AKHAVAIN MOHAMMAD
US22 patents
⚠️ This page may combine multiple inventors who share the name “AKHAVAIN MOHAMMAD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
12 patentsUS6557976B2May 6, 2003
Electrical circuit for wide-array inkjet printhead assembly
HEWLETT PACKARD DEVELOPMENT CO317 citations98
US6705705B2Mar 16, 2004
Substrate for fluid ejection devices
HEWLETT PACKARD DEVELOPMENT CO23 citations92
US6575559B2Jun 10, 2003
Joining of different materials of carrier for fluid ejection devices
HEWLETT PACKARD DEVELOPMENT CO23 citations92
US6951778B2Oct 4, 2005
Edge-sealed substrates and methods for effecting the same
HEWLETT PACKARD DEVELOPMENT CO25 citations89
US6983539B2Jan 10, 2006
Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps
HEWLETT PACKARD DEVELOPMENT CO5 citations74
US6843552B2Jan 18, 2005
Electrical circuit for printhead assembly
HEWLETT PACKARD DEVELOPMENT CO7 citations73
US7188925B2Mar 13, 2007
Fluid ejection head assembly
HEWLETT PACKARD DEVELOPMENT CO5 citations71
US7211736B2May 1, 2007
Connection pad layouts
HEWLETT PACKARD DEVELOPMENT CO5 citations62
US6698092B2Mar 2, 2004
Methods and systems for forming a die package
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7103969B2Sep 12, 2006
Methods and systems for forming a die package
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US7338149B2Mar 4, 2008
Methods for forming and protecting electrical interconnects and resultant assemblies
HEWLETT PACKARD DEVELOPMENT CO0 citations48
US6913343B2Jul 5, 2005
Methods for forming and protecting electrical interconnects and resultant assemblies
HEWLETT PACKARD DEVELOPMENT CO0 citations48
HEWLETT PACKARD CO
9 patentsUS6450614B1Sep 17, 2002
Printhead die alignment for wide-array inkjet printhead assembly
HEWLETT PACKARD CO93 citations98
US6350013B1Feb 26, 2002
Carrier positioning for wide-array inkjet printhead assembly
HEWLETT PACKARD CO132 citations98
US6543880B1Apr 8, 2003
Inkjet printhead assembly having planarized mounting layer for printhead dies
HEWLETT PACKARD CO126 citations96
US6397465B1Jun 4, 2002
Connection of electrical contacts utilizing a combination laser and fiber optic push connect system
HEWLETT PACKARD CO16 citations92
US6431683B1Aug 13, 2002
Hybrid carrier for wide-array inkjet printhead assembly
HEWLETT PACKARD CO43 citations91
US6428141B1Aug 6, 2002
Reference datums for inkjet printhead assembly
HEWLETT PACKARD CO46 citations91
US6409307B1Jun 25, 2002
Coplanar mounting of printhead dies for wide-array inkjet printhead assembly
HEWLETT PACKARD CO23 citations91
US6236015B1May 22, 2001
Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding
HEWLETT PACKARD CO11 citations69
US6476346B2Nov 5, 2002
Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding
HEWLETT PACKARD CO1 citations48