P

Inventor

LABIANCA NANCY C

US19 patents
⚠️ This page may combine multiple inventors who share the name “LABIANCA NANCY C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

15 patents
US7649257B2Jan 19, 2010

Discrete placement of radiation sources on integrated circuit devices

IBM62 citations98
US7063127B2Jun 20, 2006

Method and apparatus for chip-cooling

IBM71 citations98
US7219713B2May 22, 2007

Heterogeneous thermal interface for cooling

IBM38 citations93
US7417315B2Aug 26, 2008

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

IBM12 citations92
US6924171B2Aug 2, 2005

Bilayer wafer-level underfill

IBM51 citations92
US5859655AJan 12, 1999

Photoresist for use in ink jet printers and other micro-machining applications

IBM23 citations92
US5879859AMar 9, 1999

Strippable photoimageable compositions

IBM23 citations89
US5858943AJan 12, 1999

Gel for localized removal of reworkable encapsulant

IBM6 citations73
US5464927ANov 7, 1995

Polyamic acid and polyimide from fluorinated reactant

IBM6 citations73
US6617698B2Sep 9, 2003

Reworkable and thermally conductive adhesive and use thereof

IBM11 citations72
US7556979B2Jul 7, 2009

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

IBM1 citations63
US6777817B2Aug 17, 2004

Reworkable and thermally conductive adhesive and use thereof

IBM2 citations61
US7238547B2Jul 3, 2007

Packaging integrated circuits for accelerated detection of transient particle induced soft error rates

IBM5 citations60
US7883919B2Feb 8, 2011

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging

IBM0 citations52
US7773220B2Aug 10, 2010

Method and system for collecting alignment data from coated chips or wafers

IBM1 citations52

MACDERMID INC

1 patent

HOUGHAM GARETH GEOFFREY

1 patent

GAYNES MICHAEL

1 patent

GAYNES MICHAEL A

1 patent