Inventor
JUNG HOE-KU
KR13 patents
⚠️ This page may combine multiple inventors who share the name “JUNG HOE-KU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
10 patentsUS7992291B2Aug 9, 2011
Method of manufacturing a circuit board
SAMSUNG ELECTRO MECH9 citations84
US7858437B2Dec 28, 2010
Method for manufacturing a substrate with cavity
SAMSUNG ELECTRO MECH10 citations84
US7498205B2Mar 3, 2009
Method for manufacturing substrate with cavity
SAMSUNG ELECTRO MECH8 citations84
US7550316B2Jun 23, 2009
Board on chip package and manufacturing method thereof
SAMSUNG ELECTRO MECH5 citations74
US7937833B2May 10, 2011
Method of manufacturing circuit board
SAMSUNG ELECTRO MECH4 citations63
US7562446B2Jul 21, 2009
Method for manufacturing substrate with cavity
SAMSUNG ELECTRO MECH5 citations62
US7516545B2Apr 14, 2009
Method of manufacturing printed circuit board having landless via hole
SAMSUNG ELECTRO MECH3 citations62
US7494844B2Feb 24, 2009
Method for manufacturing substrate with cavity
SAMSUNG ELECTRO MECH5 citations62
US8003439B2Aug 23, 2011
Board on chip package and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations52
US7802358B2Sep 28, 2010
Rigid-flexible printed circuit board manufacturing method for package on package
SAMSUNG ELECTRO MECH0 citations52