Inventor
TANG JIAMIAO
CN11 patents
⚠️ This page may combine multiple inventors who share the name “TANG JIAMIAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
9 patentsUS7659143B2Feb 9, 2010
Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same
INTEL CORP71 citations97
US7373033B2May 13, 2008
Chip-to-chip optical interconnect
INTEL CORP67 citations97
US7723164B2May 25, 2010
Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same
INTEL CORP32 citations92
US9385094B2Jul 5, 2016
Apparatus, system, and method for wireless connection in integrated circuit packages
INTEL CORP4 citations83
US9778688B2Oct 3, 2017
Flexible system-in-package solutions for wearable devices
INTEL CORP5 citations73
US8981573B2Mar 17, 2015
Apparatus, system, and method for wireless connection in integrated circuit packages
INTEL CORP3 citations73
US8963333B2Feb 24, 2015
Apparatus, system, and method for wireless connection in integrated circuit packages
INTEL CORP2 citations62
US7535689B2May 19, 2009
Reducing input capacitance of high speed integrated circuits
INTEL CORP4 citations57
US9837340B2Dec 5, 2017
Apparatus, system, and method for wireless connection in integrated circuit packages
INTEL CORP0 citations51