Inventor
KWON SUNG-UN
KR20 patents
⚠️ This page may combine multiple inventors who share the name “KWON SUNG-UN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
14 patentsUS8790976B2Jul 29, 2014
Method of forming semiconductor device having self-aligned plug
SAMSUNG ELECTRONICS CO LTD5 citations83
US10573653B2Feb 25, 2020
Semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
SAMSUNG ELECTRONICS CO LTD2 citations71
US9786672B2Oct 10, 2017
Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
SAMSUNG ELECTRONICS CO LTD2 citations71
US7777265B2Aug 17, 2010
Semiconductor device having contact barrier and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations62
US7452773B2Nov 18, 2008
Method of manufacturing a flash memory device
SAMSUNG ELECTRONICS CO LTD5 citations62
US7498253B2Mar 3, 2009
Local interconnection method and structure for use in semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations52
US7202163B2Apr 10, 2007
Local interconnection method and structure for use in semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations52
US8361849B2Jan 29, 2013
Method of fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US7989279B2Aug 2, 2011
Method of fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US7659162B2Feb 9, 2010
Phase change memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US7531450B2May 12, 2009
Method of fabricating semiconductor device having contact hole with high aspect-ratio
SAMSUNG ELECTRONICS CO LTD0 citations51
US10700074B2Jun 30, 2020
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations50
US10446558B2Oct 15, 2019
Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
SAMSUNG ELECTRONICS CO LTD0 citations50
US10177155B2Jan 8, 2019
Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
SAMSUNG ELECTRONICS CO LTD0 citations50