Inventor
TORIYAMA KAZUSHIGE
JP24 patents
⚠️ This page may combine multiple inventors who share the name “TORIYAMA KAZUSHIGE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
23 patentsUS7931187B2Apr 26, 2011
Injection molded solder method for forming solder bumps on substrates
IBM16 citations92
US9354408B2May 31, 2016
Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide
IBM12 citations83
US7674651B2Mar 9, 2010
Mounting method for semiconductor parts on circuit substrate
IBM13 citations79
US8971678B2Mar 3, 2015
Spacer resin pattern helping to reduce optical coupling loss in optical waveguide for light-emitting element or light-receiving element on semiconductor
IBM5 citations73
US9772462B2Sep 26, 2017
Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide
IBM2 citations72
US9586281B2Mar 7, 2017
Forming a solder joint between metal layers
IBM2 citations72
US9698119B2Jul 4, 2017
Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
IBM2 citations71
US9893031B2Feb 13, 2018
Chip mounting structure
IBM1 citations63
US9508594B2Nov 29, 2016
Fabricating pillar solder bump
IBM2 citations63
US9299606B2Mar 29, 2016
Fabricating pillar solder bump
IBM2 citations63
US8381962B2Feb 26, 2013
Injection molded solder method for forming solder bumps on substrates
IBM3 citations63
US9391034B2Jul 12, 2016
Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
IBM2 citations61
US10424510B2Sep 24, 2019
Solder fill into high aspect through holes
IBM0 citations52
US10388566B2Aug 20, 2019
Solder fill into high aspect through holes
IBM0 citations52
US10141278B2Nov 27, 2018
Chip mounting structure
IBM0 citations52
US9466533B2Oct 11, 2016
Semiconductor structure including a through electrode, and method for forming the same
IBM1 citations52
US9373545B2Jun 21, 2016
Semiconductor structure including a through electrode, and method for forming the same
IBM0 citations52
US10252363B2Apr 9, 2019
Forming a solder joint between metal layers
IBM0 citations51
US10090586B2Oct 2, 2018
Wireless communication device with joined semiconductors
IBM0 citations51
US9780442B2Oct 3, 2017
Wireless communication device with joined semiconductors
IBM0 citations51
US9941230B2Apr 10, 2018
Electrical connecting structure between a substrate and a semiconductor chip
IBM0 citations48
US9099315B2Aug 4, 2015
Mounting structure and mounting structure manufacturing method
IBM0 citations41
US9520375B2Dec 13, 2016
Method of forming a solder bump on a substrate
IBM0 citations38