Inventor

ROMIG MATTHEW DAVID

US24 patents

⚠️ This page may combine multiple inventors who share the name “ROMIG MATTHEW DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ROMIG MATTHEW DAVID

TEXAS INSTRUMENTS INC

Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide

Bond wire support systems and methods

Packaged device with additive substrate surface modification

Packaged device with additive substrate surface modification

Printed interconnects for semiconductor packages

Packaged semiconductor system having unidirectional connections to discrete components

Multi-chip module leadless package

3D-printed protective shell structures for stress sensitive circuits

Integrated circuit package for isolation dies

Methods, apparatus, and systems to facilitate multi-channel isolation

Methods, apparatus, and systems to facilitate multi-channel isolation

Apparatus for connecting integrated circuit chip to power and ground circuits

Electronic assembly with three dimensional inkjet printed traces

Multi-chip module leadless package

3D-printed protective shell structures with support columns for stress sensitive circuits

Integrated circuit package with printed circuit layer

Thermistor die-based thermal probe

Printed interconnects for semiconductor packages

Discrete device mounted on substrate

Integrated circuit package with printed circuit layer

Packaged semiconductor system having unidirectional connections to discrete components

Integrated power package

Integrated circuit package and method

ROMIG MATTHEW DAVID

Electronic assembly with three dimensional inkjet printed traces