Inventor
FULLER ANTHONY M
US39 patents
⚠️ This page may combine multiple inventors who share the name “FULLER ANTHONY M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
27 patentsUS8870337B1Oct 28, 2014
Printhead die with damage detection conductor between multiple termination rings
HEWLETT PACKARD DEVELOPMENT CO22 citations88
US11413864B2Aug 16, 2022
Die for a printhead
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US11413865B2Aug 16, 2022
Fluid ejection devices including contact pads
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11787180B2Oct 17, 2023
Corrosion tolerant micro-electromechanical fluid ejection device
HEWLETT PACKARD DEVELOPMENT CO2 citations72
US12391044B2Aug 19, 2025
Fluid ejection device with break(s) in cover layer
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11745507B2Sep 5, 2023
Fluid ejection device with break(s) in cover layer
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11721636B2Aug 8, 2023
Circuit die alignment target
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11639055B2May 2, 2023
Fluid ejection devices including contact pads
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11383514B2Jul 12, 2022
Die for a printhead
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11097537B2Aug 24, 2021
Fluid ejection die molded into molded body
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US10086612B2Oct 2, 2018
Fluid ejection device with ink feedhole bridge
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US12491716B2Dec 9, 2025
Corrosion tolerant micro-electromechanical fluid ejection device
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US10933634B2Mar 2, 2021
Conductive wire disposed in a layer
HEWLETT PACKARD DEVELOPMENT CO1 citations59
US11827021B2Nov 28, 2023
Applying mold chase structure to end portion of fluid ejection die
HEWLETT PACKARD DEVELOPMENT CO0 citations58
US11390081B2Jul 19, 2022
Fluid ejection device with a carrier having a slot
HEWLETT PACKARD DEVELOPMENT CO0 citations58
US11472180B2Oct 18, 2022
Fluid ejection devices including electrical interconnect elements for fluid ejection dies
HEWLETT PACKARD DEVELOPMENT CO0 citations53
US11642884B2May 9, 2023
Die for a printhead
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US11267243B2Mar 8, 2022
Die for a printhead
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10927472B2Feb 23, 2021
Method of forming a micro-structure
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10864719B2Dec 15, 2020
Fluid ejection device including integrated circuit
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10814629B2Oct 27, 2020
Termination ring with gapped metallic layer
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10479080B2Nov 19, 2019
Fluid ejection device with ink feedhole bridge
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US7862156B2Jan 4, 2011
Heating element
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US7837886B2Nov 23, 2010
Heating element
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US9289987B2Mar 22, 2016
Heating element for a printhead
HEWLETT PACKARD DEVELOPMENT CO0 citations50
US10287697B2May 14, 2019
Nano-structure and method of making the same
HEWLETT PACKARD DEVELOPMENT CO0 citations49
US10465308B2Nov 5, 2019
Adhesion-promoting surface
HEWLETT PACKARD DEVELOPMENT CO0 citations42
MARDILOVICH PETER
7 patentsUS9624101B2Apr 18, 2017
Article with controlled wettability
MARDILOVICH PETER10 citations82
US9447513B2Sep 20, 2016
Nano-scale structures
MARDILOVICH PETER3 citations73
US9359195B2Jun 7, 2016
Method of forming a nano-structure
MARDILOVICH PETER6 citations73
US9611559B2Apr 4, 2017
Nano-structure and method of making the same
MARDILOVICH PETER2 citations69
US9410260B2Aug 9, 2016
Method of forming a nano-structure
MARDILOVICH PETER2 citations62
US9751755B2Sep 5, 2017
Method of forming a micro-structure
MARDILOVICH PETER1 citations52
US8961799B2Feb 24, 2015
Nano-structured surface
MARDILOVICH PETER0 citations52
HEWLETT PACKARD DEVELOPMENT CO LP
4 patentsUS9776402B2Oct 3, 2017
Thermal ink jet printhead
HEWLETT PACKARD DEVELOPMENT CO LP12 citations81
US9498953B2Nov 22, 2016
Printhead die with multiple termination rings
HEWLETT PACKARD DEVELOPMENT CO LP3 citations71
US9776407B2Oct 3, 2017
Fluid ejection device with ink feedhole bridge
HEWLETT PACKARD DEVELOPMENT CO LP1 citations62
US9815282B2Nov 14, 2017
Fluid ejection structure
HEWLETT PACKARD DEVELOPMENT CO LP1 citations49