Inventor
BAEK SEUNGDUK
KR15 patents
Patents
15 patentsUS9165916B2Oct 20, 2015
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD14 citations84
US11495576B2Nov 8, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US10847447B2Nov 24, 2020
Semiconductor device having planarized passivation layer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US11721604B2Aug 8, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations68
US12347819B2Jul 1, 2025
Semiconductor package having stacked semiconductor chips
SAMSUNG ELECTRONICS CO LTD1 citations62
US11488894B2Nov 1, 2022
Semiconductor device having planarized passivation layer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12125753B2Oct 22, 2024
Semiconductor package including test bumps
SAMSUNG ELECTRONICS CO LTD0 citations61
US11257725B2Feb 22, 2022
Semiconductor package including test bumps
SAMSUNG ELECTRONICS CO LTD1 citations61
US11721601B2Aug 8, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations60
US12154881B2Nov 26, 2024
Integrated circuit device having redistribution pattern
SAMSUNG ELECTRONICS CO LTD0 citations58
US11640951B2May 2, 2023
Integrated circuit device having redistribution pattern
SAMSUNG ELECTRONICS CO LTD0 citations58
US12525559B2Jan 13, 2026
Semiconductor packages including directly bonded pads
SAMSUNG ELECTRONICS CO LTD0 citations51
US12368119B2Jul 22, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12438064B2Oct 7, 2025
Semiconductor package with bonding interface
SAMSUNG ELECTRONICS CO LTD0 citations50
US9646895B2May 9, 2017
Semiconductor package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD0 citations41