Inventor
HON-WONG KEITH KWONG
US6 patents
⚠️ This page may combine multiple inventors who share the name “HON-WONG KEITH KWONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
4 patentsUS7951714B2May 31, 2011
High aspect ratio electroplated metal feature and method
IBM2 citations62
US7498256B2Mar 3, 2009
Copper contact via structure using hybrid barrier layer
IBM5 citations62
US7442614B1Oct 28, 2008
Silicon on insulator devices having body-tied-to-source and methods of making
IBM4 citations60
US7518191B1Apr 14, 2009
Silicon on insulator devices having body-tied-to-source and methods of making
IBM1 citations50