Inventor
KANG MYUNG-SUNG
KR11 patents
⚠️ This page may combine multiple inventors who share the name “KANG MYUNG-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
10 patentsUS7807507B2Oct 5, 2010
Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package
SAMSUNG ELECTRONICS CO LTD8 citations83
US9991234B2Jun 5, 2018
Semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations71
US10923465B2Feb 16, 2021
Semiconductor device having stacked semiconductor chips and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations70
US10354985B2Jul 16, 2019
Semiconductor device having stacked semiconductor chips and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations70
US10043780B2Aug 7, 2018
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations70
US12183653B2Dec 31, 2024
Thermal conductive film
SAMSUNG ELECTRONICS CO LTD2 citations69
US11355413B2Jun 7, 2022
Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD4 citations69
US8958011B2Feb 17, 2015
Bi-directional camera module and flip chip bonder including the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US10910339B2Feb 2, 2021
Flip chip bonding method
SAMSUNG ELECTRONICS CO LTD0 citations60
US10446525B2Oct 15, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49