Inventor
YOO HYEIN
KR8 patents
⚠️ This page may combine multiple inventors who share the name “YOO HYEIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
7 patentsUS9929131B2Mar 27, 2018
Method of fabricating a semiconductor package having mold layer with curved corner
SAMSUNG ELECTRONICS CO LTD2 citations71
US10923465B2Feb 16, 2021
Semiconductor device having stacked semiconductor chips and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations70
US10354985B2Jul 16, 2019
Semiconductor device having stacked semiconductor chips and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations70
US10115613B2Oct 30, 2018
Method of fabricating a fan-out panel level package and a carrier tape film therefor
SAMSUNG ELECTRONICS CO LTD5 citations70
US12183653B2Dec 31, 2024
Thermal conductive film
SAMSUNG ELECTRONICS CO LTD2 citations69
US11355413B2Jun 7, 2022
Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD4 citations69
US10147713B2Dec 4, 2018
Semiconductor package having mold layer with curved corner and method of fabricating same
SAMSUNG ELECTRONICS CO LTD0 citations50