Inventor
COOK BENJAMIN STASSEN
US144 patents
Patents
50 patentsUS10461810B2Oct 29, 2019
Launch topology for field confined near field communication system
TEXAS INSTRUMENTS INC112 citations98
US10425793B2Sep 24, 2019
Staggered back-to-back launch topology with diagonal waveguides for field confined near field communication system
TEXAS INSTRUMENTS INC113 citations98
US10389410B2Aug 20, 2019
Integrated artificial magnetic launch surface for near field communication system
TEXAS INSTRUMENTS INC115 citations98
US10171578B1Jan 1, 2019
Tapered coax launch structure for a near field communication system
TEXAS INSTRUMENTS INC114 citations98
US10027376B2Jul 17, 2018
Guided near field communication for short range data communication
TEXAS INSTRUMENTS INC114 citations97
US10908414B2Feb 2, 2021
Lens cleaning via electrowetting
TEXAS INSTRUMENTS INC17 citations94
US9865537B1Jan 9, 2018
Methods and apparatus for integrated circuit failsafe fuse package with arc arrest
TEXAS INSTRUMENTS INC18 citations85
US10748999B2Aug 18, 2020
Multi-super lattice for switchable arrays
TEXAS INSTRUMENTS INC6 citations84
US10131115B1Nov 20, 2018
Hermetically sealed molecular spectroscopy cell with dual wafer bonding
TEXAS INSTRUMENTS INC7 citations84
US9865527B1Jan 9, 2018
Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
TEXAS INSTRUMENTS INC5 citations84
US9793214B1Oct 17, 2017
Heterostructure interconnects for high frequency applications
TEXAS INSTRUMENTS INC18 citations84
US9590699B1Mar 7, 2017
Guided near field communication for short range data communication
TEXAS INSTRUMENTS INC12 citations83
US11195811B2Dec 7, 2021
Dielectric and metallic nanowire bond layers
TEXAS INSTRUMENTS INC7 citations82
US11693235B2Jul 4, 2023
Lens cleaning via electrowetting
TEXAS INSTRUMENTS INC2 citations73
US11390527B2Jul 19, 2022
Multi-layered SP2-bonded carbon tubes
TEXAS INSTRUMENTS INC3 citations73
US11145598B2Oct 12, 2021
Lattice bump interconnect
TEXAS INSTRUMENTS INC3 citations73
US11049836B2Jun 29, 2021
Bond wire support systems and methods
TEXAS INSTRUMENTS INC2 citations73
US10910465B2Feb 2, 2021
3D printed semiconductor package
TEXAS INSTRUMENTS INC3 citations73
US10801985B2Oct 13, 2020
Sensing capacitor with a permeable electrode
TEXAS INSTRUMENTS INC5 citations73
US10804201B2Oct 13, 2020
Dissimilar material interface having lattices
TEXAS INSTRUMENTS INC3 citations73
US10780467B2Sep 22, 2020
Methods and apparatus for surface wetting control
TEXAS INSTRUMENTS INC3 citations73
US10775422B2Sep 15, 2020
Molecular spectroscopy cell with resonant cavity
TEXAS INSTRUMENTS INC2 citations73
US10549986B2Feb 4, 2020
Hermetically sealed molecular spectroscopy cell
TEXAS INSTRUMENTS INC2 citations73
US10520900B2Dec 31, 2019
Methods and apparatus for magnetically compensated chip scale atomic clock
TEXAS INSTRUMENTS INC2 citations73
US10493722B2Dec 3, 2019
Hermetically sealed molecular spectroscopy cell with dual wafer bonding
TEXAS INSTRUMENTS INC2 citations73
US10498001B2Dec 3, 2019
Launch structures for a hermetically sealed cavity
TEXAS INSTRUMENTS INC3 citations73
US10444432B2Oct 15, 2019
Galvanic signal path isolation in an encapsulated package using a photonic structure
TEXAS INSTRUMENTS INC3 citations73
US10424523B2Sep 24, 2019
Hermetically sealed molecular spectroscopy cell with buried ground plane
TEXAS INSTRUMENTS INC4 citations73
US10371891B2Aug 6, 2019
Integrated circuit with dielectric waveguide connector using photonic bandgap structure
TEXAS INSTRUMENTS INC3 citations73
US10354890B2Jul 16, 2019
Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
TEXAS INSTRUMENTS INC2 citations73
US10256188B2Apr 9, 2019
Interconnect via with grown graphitic material
TEXAS INSTRUMENTS INC3 citations73
US10181521B2Jan 15, 2019
Graphene heterolayers for electronic applications
TEXAS INSTRUMENTS INC3 citations73
US10121847B2Nov 6, 2018
Galvanic isolation device
TEXAS INSTRUMENTS INC5 citations73
US9780017B2Oct 3, 2017
Packaged device with additive substrate surface modification
TEXAS INSTRUMENTS INC3 citations73
US9614584B2Apr 4, 2017
Simultaneous launching of multiple signal channels in a dielectric waveguide using different electromagnetic modes
TEXAS INSTRUMENTS INC3 citations73
US9524926B2Dec 20, 2016
Packaged device with additive substrate surface modification
TEXAS INSTRUMENTS INC4 citations73
US9496171B2Nov 15, 2016
Printed interconnects for semiconductor packages
TEXAS INSTRUMENTS INC3 citations73
US12176298B2Dec 24, 2024
Floating die package
TEXAS INSTRUMENTS INC2 citations72
US10861796B2Dec 8, 2020
Floating die package
TEXAS INSTRUMENTS INC4 citations72
US10832993B1Nov 10, 2020
Packaged multichip device with stacked die having a metal die attach
TEXAS INSTRUMENTS INC2 citations72
US11865773B2Jan 9, 2024
Additive process for circular printing of electronic devices
TEXAS INSTRUMENTS INC3 citations71
US11282807B2Mar 22, 2022
Nanowires plated on nanoparticles
TEXAS INSTRUMENTS INC2 citations71
US11128023B2Sep 21, 2021
Substrate design for efficient coupling between a package and a dielectric waveguide
TEXAS INSTRUMENTS INC3 citations71
US11031364B2Jun 8, 2021
Nanoparticle backside die adhesion layer
TEXAS INSTRUMENTS INC2 citations71
US10692964B2Jun 23, 2020
Semiconductor die with back-side integrated inductive component
TEXAS INSTRUMENTS INC1 citations71
US10544039B2Jan 28, 2020
Methods for depositing a measured amount of a species in a sealed cavity
TEXAS INSTRUMENTS INC2 citations71
US10032850B2Jul 24, 2018
Semiconductor die with back-side integrated inductive component
TEXAS INSTRUMENTS INC4 citations71
US9646906B2May 9, 2017
Semiconductor package with printed sensor
TEXAS INSTRUMENTS INC5 citations71
US11128345B2Sep 21, 2021
Contactless interface for mm-wave near field communication
TEXAS INSTRUMENTS INC1 citations63
US10547350B2Jan 28, 2020
Contactless interface for mm-wave near field communication
TEXAS INSTRUMENTS INC1 citations63
Showing the top 50 of 144 patents by PatentIndex Score.