Inventor
LEESER KARL F
US54 patents
⚠️ This page may combine multiple inventors who share the name “LEESER KARL F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
29 patentsUS9875891B2Jan 23, 2018
Selective inhibition in atomic layer deposition of silicon-containing films
LAM RES CORP478 citations99
US9564312B2Feb 7, 2017
Selective inhibition in atomic layer deposition of silicon-containing films
LAM RES CORP415 citations99
US10121689B2Nov 6, 2018
Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP43 citations98
US10109517B1Oct 23, 2018
Rotational indexer with additional rotational axes
LAM RES CORP58 citations98
US9960068B1May 1, 2018
Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP26 citations94
US9892956B1Feb 13, 2018
Wafer positioning pedestal for semiconductor processing
LAM RES CORP28 citations94
US9704692B2Jul 11, 2017
System for instantaneous radiofrequency power measurement and associated methods
LAM RES CORP22 citations94
US9263350B2Feb 16, 2016
Multi-station plasma reactor with RF balancing
LAM RES CORP19 citations92
US10804099B2Oct 13, 2020
Selective inhibition in atomic layer deposition of silicon-containing films
LAM RES CORP13 citations86
US11056380B2Jul 6, 2021
Wafer positioning pedestal for semiconductor processing
LAM RES CORP4 citations84
US10870922B2Dec 22, 2020
Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP6 citations84
US10699937B2Jun 30, 2020
Wafer positioning pedestal for semiconductor processing
LAM RES CORP8 citations84
US10354909B2Jul 16, 2019
Wafer positioning pedestal for semiconductor processing
LAM RES CORP5 citations84
US10020220B2Jul 10, 2018
Wafer positioning pedestal for semiconductor processing
LAM RES CORP9 citations84
US9840776B2Dec 12, 2017
Multi-station plasma reactor with RF balancing
LAM RES CORP7 citations84
US9596744B2Mar 14, 2017
Radio frequency generator having multiple mutually exclusive oscillators for use in plasma processing
LAM RES CORP10 citations84
US11387136B2Jul 12, 2022
Pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP3 citations73
US10573549B2Feb 25, 2020
Pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP3 citations73
US10570515B2Feb 25, 2020
Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP3 citations73
US10145010B2Dec 4, 2018
Multi-station plasma reactor with RF balancing
LAM RES CORP4 citations73
US12379720B2Aug 5, 2025
Common terminal heater for ceramic pedestals used in semiconductor for fabrication
LAM RES CORP0 citations63
US11768011B2Sep 26, 2023
Apparatus for thermal control of tubing assembly and associated methods
LAM RES CORP0 citations63
US11131480B2Sep 28, 2021
Apparatus for thermal control of tubing assembly and associated methods
LAM RES CORP0 citations63
US10591182B2Mar 17, 2020
Apparatus for thermal control of tubing assembly and associated methods
LAM RES CORP1 citations63
US11955366B2Apr 9, 2024
Pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP0 citations62
US10879048B2Dec 29, 2020
Flow through line charge volume
LAM RES CORP0 citations52
US10526700B2Jan 7, 2020
Hardware and process for film uniformity improvement
LAM RES CORP0 citations52
US10139132B2Nov 27, 2018
Apparatus for thermal control of tubing assembly and associated methods
LAM RES CORP1 citations52
US10100407B2Oct 16, 2018
Hardware and process for film uniformity improvement
LAM RES CORP1 citations52
NOVELLUS SYSTEMS INC
10 patentsUS6878402B2Apr 12, 2005
Method and apparatus for improved temperature control in atomic layer deposition
NOVELLUS SYSTEMS INC499 citations99
US6800173B2Oct 5, 2004
Variable gas conductance control for a process chamber
NOVELLUS SYSTEMS INC134 citations98
US6949450B2Sep 27, 2005
Method for integrated in-situ cleaning and subsequent atomic layer deposition within a single processing chamber
NOVELLUS SYSTEMS INC44 citations93
US7806983B2Oct 5, 2010
Substrate temperature control in an ALD reactor
NOVELLUS SYSTEMS INC24 citations92
US7318869B2Jan 15, 2008
Variable gas conductance control for a process chamber
NOVELLUS SYSTEMS INC32 citations92
US7189432B2Mar 13, 2007
Varying conductance out of a process region to control gas flux in an ALD reactor
NOVELLUS SYSTEMS INC36 citations92
US10400333B2Sep 3, 2019
Hybrid ceramic showerhead
NOVELLUS SYSTEMS INC7 citations84
US7871676B2Jan 18, 2011
System for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)
NOVELLUS SYSTEMS INC13 citations84
US7601393B2Oct 13, 2009
Controlling the temperature of a substrate in a film deposition apparatus
NOVELLUS SYSTEMS INC8 citations84
US7348042B2Mar 25, 2008
Continuous method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)
NOVELLUS SYSTEMS INC11 citations84
ANGSTRON SYSTEMS INC
4 patentsUS6569501B2May 27, 2003
Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)
ANGSTRON SYSTEMS INC238 citations99
US6428859B1Aug 6, 2002
Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)
ANGSTRON SYSTEMS INC810 citations99
US6416822B1Jul 9, 2002
Continuous method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)
ANGSTRON SYSTEMS INC416 citations99
US6630201B2Oct 7, 2003
Adsorption process for atomic layer deposition
ANGSTRON SYSTEMS INC337 citations98
APPLIED MATERIALS INC
4 patentsUS6236555B1May 22, 2001
Method for rapidly dechucking a semiconductor wafer from an electrostatic chuck utilizing a hysteretic discharge cycle
APPLIED MATERIALS INC58 citations96
US6430022B2Aug 6, 2002
Method and apparatus for controlling chucking force in an electrostatic
APPLIED MATERIALS INC26 citations93
US6307728B1Oct 23, 2001
Method and apparatus for dechucking a workpiece from an electrostatic chuck
APPLIED MATERIALS INC33 citations93
US6179921B1Jan 30, 2001
Backside gas delivery system for a semiconductor wafer processing system
APPLIED MATERIALS INC42 citations92
SABRI MOHAMED
1 patentLEESER KARL F
1 patentCHANDRASEKHARAN RAMESH
1 patentShowing the top 50 of 54 patents by PatentIndex Score.