Inventor
BLAHNIK DAVID
US19 patents
⚠️ This page may combine multiple inventors who share the name “BLAHNIK DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
17 patentsUS11355367B2Jun 7, 2022
Robot for simultaneous substrate transfer
APPLIED MATERIALS INC9 citations84
US10854483B2Dec 1, 2020
High pressure steam anneal processing apparatus
APPLIED MATERIALS INC15 citations84
US10103046B2Oct 16, 2018
Buffer chamber wafer heating mechanism and supporting robot
APPLIED MATERIALS INC6 citations83
US11078568B2Aug 3, 2021
Pumping apparatus and method for substrate processing chambers
APPLIED MATERIALS INC4 citations73
US11476135B2Oct 18, 2022
Robot for simultaneous substrate transfer
APPLIED MATERIALS INC5 citations72
US11315806B2Apr 26, 2022
Batch heating and cooling chamber or loadlock
APPLIED MATERIALS INC2 citations72
US11094504B2Aug 17, 2021
Resonator coil having an asymmetrical profile
APPLIED MATERIALS INC2 citations72
US11948817B2Apr 2, 2024
Robot for simultaneous substrate transfer
APPLIED MATERIALS INC0 citations62
US11856685B2Dec 26, 2023
Stiffened RF LINAC coil inductor with internal support structure
APPLIED MATERIALS INC0 citations62
US11710617B2Jul 25, 2023
Resonator coil having an asymmetrical profile
APPLIED MATERIALS INC0 citations62
US11264258B2Mar 1, 2022
Buffer chamber wafer heating mechanism and supporting robots
APPLIED MATERIALS INC0 citations62
US12249522B2Mar 11, 2025
Processing chamber with annealing mini-environment
APPLIED MATERIALS INC0 citations60
US11791176B2Oct 17, 2023
Processing chamber with annealing mini-environment
APPLIED MATERIALS INC0 citations60
US11434569B2Sep 6, 2022
Ground path systems for providing a shorter and symmetrical ground path
APPLIED MATERIALS INC0 citations52
US12340984B2Jun 24, 2025
Radio frequency power return path
APPLIED MATERIALS INC0 citations51
US12183553B2Dec 31, 2024
Baffle implementation for improving bottom purge gas flow uniformity
APPLIED MATERIALS INC0 citations51
US10699930B2Jun 30, 2020
Buffer chamber wafer heating mechanism and supporting robots
APPLIED MATERIALS INC0 citations51