P

Inventor

PARK JE SANG

KR15 patents

Patents

15 patents
US11627659B2Apr 11, 2023

Printed circuit board and electronic package comprising the same

SAMSUNG ELECTRO MECH2 citations71
US11183462B2Nov 23, 2021

Substrate having electronic component embedded therein

SAMSUNG ELECTRO MECH2 citations69
US10863627B1Dec 8, 2020

Electronic component embedded substrate

SAMSUNG ELECTRO MECH5 citations69
US11658417B2May 23, 2023

Antenna substrate

SAMSUNG ELECTRO MECH0 citations61
US12341252B2Jun 24, 2025

Antenna substrate and electronic device including the same

SAMSUNG ELECTRO MECH0 citations60
US11631643B2Apr 18, 2023

Substrate embedded electronic component package

SAMSUNG ELECTRO MECH0 citations60
US11587878B2Feb 21, 2023

Substrate having electronic component embedded therein

SAMSUNG ELECTRO MECH1 citations60
US11251133B2Feb 15, 2022

Substrate having electronic component embedded therein

SAMSUNG ELECTRO MECH0 citations60
US10925163B2Feb 16, 2021

Printed circuit board

SAMSUNG ELECTRO MECH0 citations60
US12119565B2Oct 15, 2024

Antenna substrate

SAMSUNG ELECTRO MECH0 citations50
US11075156B2Jul 27, 2021

Substrate having electronic component embedded therein

SAMSUNG ELECTRO MECH0 citations50
US11495546B2Nov 8, 2022

Substrate having electronic component embedded therein

SAMSUNG ELECTRO MECH0 citations49
US11244905B2Feb 8, 2022

Substrate with electronic component embedded therein

SAMSUNG ELECTRO MECH0 citations49
US11640952B2May 2, 2023

Electronic component embedded substrate

SAMSUNG ELECTRO MECH0 citations48
US12446163B2Oct 14, 2025

Printed circuit board and method for manufacturing the same

SAMSUNG ELECTRO MECH0 citations44