Inventor
JEONG CHAN HEE
KR3 patents
Patents
3 patentsUS9978693B2May 22, 2018
Integrated circuit package, method of fabricating the same, and wearable device including integrated circuit package
SAMSUNG ELECTRONICS CO LTD9 citations81
US10204869B2Feb 12, 2019
Integrated circuit package including shielding between adjacent chips
SAMSUNG ELECTRONICS CO LTD3 citations70
US11031307B2Jun 8, 2021
Semiconductor package, buffer wafer for semiconductor package, and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51