Inventor

HOANG LAN H

US19 patents

⚠️ This page may combine multiple inventors who share the name “HOANG LAN H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HOANG LAN H

APPLE INC

Vertical module and perpendicular pin array interconnect for stacked circuit board structure

System in package for lower z height and reworkable component assembly

Flex board and flexible module

Technologies for increased volumetric and functional efficiencies of optical packages

Vertical shielding and interconnect for SIP modules

Sidewall connections and button interconnects for molded SiPs

Right angle sidewall and button interconnects for molded SiPs

Built-in connector for board-to-board and flex-to-rigid board connection

Interconnect frames for SIP modules

Area-efficient connections to SIP modules

XILINX INC

Composite flip-chip package with encased components and method of fabricating same

Multi-chip configuration to connect flip-chips to flip-chips

Composite flip-chip package with encased components and method of fabricating same

High performance flipchip package that incorporates heat removal with minimal thermal mismatch

Molded integrated circuit package and method of forming a molded integrated circuit package

Molded high density electronic packaging structure for high performance applications

LSI LOGIC CORP

Method of adding filler into a non-filled underfill system by using a highly filled fillet

Low cost thermally enhanced flip chip BGA

NAT SEMICONDUCTOR CORP

Leaded substrate carrier for integrated circuit device and leaded substrate carrier device assembly