Inventor
JEON HYUNGJUN
KR17 patents
⚠️ This page may combine multiple inventors who share the name “JEON HYUNGJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
15 patentsUS9496163B2Nov 15, 2016
Carrier and method of fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD4 citations72
US11749586B2Sep 5, 2023
Semiconductor device including through via structure
SAMSUNG ELECTRONICS CO LTD3 citations71
US10651074B2May 12, 2020
Substrate processing apparatus and method of manufacture using the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US12046538B2Jul 23, 2024
Semiconductor device including through via structure
SAMSUNG ELECTRONICS CO LTD0 citations60
US11694980B2Jul 4, 2023
Semiconductor stack and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11315894B2Apr 26, 2022
Semiconductor stack and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12456631B2Oct 28, 2025
Method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US12300671B2May 13, 2025
Semiconductor packages and methods of manufacturing the semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations59
US11810900B2Nov 7, 2023
Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations59
US11721562B2Aug 8, 2023
Substrate bonding apparatus
SAMSUNG ELECTRONICS CO LTD0 citations59
US12593714B2Mar 31, 2026
Semiconductor device including bonding enhancement layer and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12476234B2Nov 18, 2025
Semiconductor device including through electrodes
SAMSUNG ELECTRONICS CO LTD0 citations51
US11908775B2Feb 20, 2024
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US11804419B2Oct 31, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations50
US9399822B2Jul 26, 2016
Liquid compositions and methods of fabricating a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations47