Inventor
KIM HOECHUL
KR9 patents
Patents
9 patentsUS10923452B2Feb 16, 2021
Substrate bonding apparatus
SAMSUNG ELECTRONICS CO LTD7 citations80
US11152317B2Oct 19, 2021
Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US12136602B2Nov 5, 2024
Method of fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations61
US11594443B2Feb 28, 2023
Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus
SAMSUNG ELECTRONICS CO LTD1 citations61
US12224262B2Feb 11, 2025
Substrate bonding apparatus and method of manufacturing semiconductor device by using the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11990444B2May 21, 2024
Substrate bonding apparatus and method of manufacturing semiconductor device by using the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12456631B2Oct 28, 2025
Method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US11721562B2Aug 8, 2023
Substrate bonding apparatus
SAMSUNG ELECTRONICS CO LTD0 citations59
US11728197B2Aug 15, 2023
Wafer to wafer bonding apparatus and wafer to wafer bonding method
SAMSUNG ELECTRONICS CO LTD0 citations47