Inventor

LEE CHIEN-WEI

TW37 patents

⚠️ This page may combine multiple inventors who share the name “LEE CHIEN-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE CHIEN-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Interfacial layer between fin and source/drain region

FinFET structure and method for manufacturing thereof

Fin field effect transistor and method for fabricating the same

Warpage control in the packaging of integrated circuits

Fin field-effect transistor device and method of forming the same

FinFET device and method

Warpage control in the packaging of integrated circuits

Semiconductor device and method

Semiconductor device and method

Low Ge isolated epitaxial layer growth over nano-sheet architecture design for RP reduction

Semiconductor device and method

Fin field-effect transistor device and method of forming the same

Transistors with recessed silicon cap and method forming same

FinFET device and method of forming same

Warpage control in the packaging of integrated circuits

FinFET device and method

Method for forming semiconductor structure

Method of forming a source/drain

FinFET structure and method for manufacturing thereof

Fin field-effect transistor device and method of forming the same

FinFET structure and method for manufacturing thereof

FinFET device and method of forming same

Transistors with recessed silicon cap and method forming same

Method for forming fin field effect transistor device structure

Method of forming a source/drain

Source/drain structure for semiconductor device

Interfacial layer between fin and source/drain region

Source/drain structure for semiconductor device

Interfacial layer between Fin and source/drain region

Interfacial layer between fin and source/drain region

Semiconductor device structure and method for forming the same

Semiconductor devices with a source/drain barrier layer and methods of manufacture

Nanosheet semiconductor device and method for manufacturing the same

CHENG MING-DA

Warpage control in the packaging of integrated circuits

REALTEK SEMICONDUCTOR CORP

Data communication and processing method of master device and slave device

HUANG HUI-MIN

Semiconductor device and fabrication method thereof

LIN YU-TONG

Driving circuit of input/output interface with changeable output force