Inventor
KASCHAK RONALD A
US12 patents
Patents
12 patentsUS5189261AFeb 23, 1993
Electrical and/or thermal interconnections and methods for obtaining such
IBM52 citations89
US4623554ANov 18, 1986
Method for controlling plating rate in an electroless plating system
IBM20 citations82
US4904506AFeb 27, 1990
Copper deposition from electroless plating bath
IBM19 citations79
US4554184ANov 19, 1985
Method for plating from an electroless plating bath
IBM13 citations73
US6693031B2Feb 17, 2004
Formation of a metallic interlocking structure
IBM7 citations72
US6348737B1Feb 19, 2002
Metallic interlocking structure
IBM8 citations72
US4684545AAug 4, 1987
Electroless plating with bi-level control of dissolved oxygen
IBM14 citations70
US4552787ANov 12, 1985
Deposition of a metal from an electroless plating composition
IBM10 citations63
US4707377ANov 17, 1987
Copper plating
IBM5 citations61
US4967690ANov 6, 1990
Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means
IBM3 citations59
US4756923AJul 12, 1988
Method of controlling resistivity of plated metal and product formed thereby
IBM2 citations56
US5334461AAug 2, 1994
Product formed by method of controlling resistivity of plated metal
IBM0 citations45