Inventor
YI MI HIE
KR14 patents
⚠️ This page may combine multiple inventors who share the name “YI MI HIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOREA RES INST CHEM TECH
12 patentsUS6172127B1Jan 9, 2001
Preparation of polyimide foam
KOREA RES INST CHEM TECH25 citations91
US6013760AJan 11, 2000
Soluble polyimide resin for liquid crystal alignment layer and process of preparation of the same
KOREA RES INST CHEM TECH18 citations91
US5532334AJul 2, 1996
Process for preparing polyamideimide resins having high molecular weight
KOREA RES INST CHEM TECH19 citations83
US6054554AApr 25, 2000
Soluble polyimide resin comprising polyalicyclic structure
KOREA RES INST CHEM TECH17 citations82
US5521276AMay 28, 1996
Polyamideimide resins containing isophorone diamine structures
KOREA RES INST CHEM TECH18 citations81
US5955568ASep 21, 1999
Process for preparing polyamideimide resins by direct polymerization
KOREA RES INST CHEM TECH11 citations73
US5243010ASep 7, 1993
Aromatic polyamide containing pendant silyl groups
KOREA RES INST CHEM TECH13 citations73
US6162893ADec 19, 2000
Soluble polyimide resin having a dialkyl substituent for a liquid crystal alignment layer, the monomers and manufacturing methods thereof
KOREA RES INST CHEM TECH9 citations72
US6031067AFeb 29, 2000
Soluble polyimide resin and process of preparation of the same
KOREA RES INST CHEM TECH14 citations72
US5824766AOct 20, 1998
Polyamideamic acid resin prepolymers, high heat resistant polyamideimide foams prepared therefrom, and processes for preparing them
KOREA RES INST CHEM TECH7 citations72
US5241037AAug 31, 1993
Nadimide-terminated polyarylates and cured polyarylate resins
KOREA RES INST CHEM TECH7 citations72
US6046303AApr 4, 2000
Soluble polyimide resin having alkoxy substituents and the preparation method thereof
KOREA RES INST CHEM TECH9 citations68
KIM DONG-SEOK
2 patentsUS8232366B2Jul 31, 2012
Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof
KIM DONG-SEOK3 citations60
US8703901B2Apr 22, 2014
Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof
KIM DONG-SEOK0 citations50