Inventor
FAN YANG-TUNG
TW24 patents
Patents
24 patentsUS6605524B1Aug 12, 2003
Bumping process to increase bump height and to create a more robust bump structure
TAIWAN SEMICONDUCTOR MFG78 citations98
US6482669B1Nov 19, 2002
Colors only process to reduce package yield loss
TAIWAN SEMICONDUCTOR MFG81 citations98
US6426281B1Jul 30, 2002
Method to form bump in bumping technology
TAIWAN SEMICONDUCTOR MFG147 citations98
US6171885B1Jan 9, 2001
High efficiency color filter process for semiconductor array imaging devices
TAIWAN SEMICONDUCTOR MFG125 citations98
US6586323B1Jul 1, 2003
Method for dual-layer polyimide processing on bumping technology
TAIWAN SEMICONDUCTOR MFG76 citations97
US6274917B1Aug 14, 2001
High efficiency color filter process for semiconductor array imaging devices
TAIWAN SEMICONDUCTOR MFG117 citations97
US6214717B1Apr 10, 2001
Method for adding plasma treatment on bond pad to prevent bond pad staining problems
TAIWAN SEMICONDUCTOR MFG357 citations97
US6171883B1Jan 9, 2001
Image array optoelectronic microelectronic fabrication with enhanced optical stability and method for fabrication thereof
TAIWAN SEMICONDUCTOR MFG95 citations97
US6632700B1Oct 14, 2003
Method to form a color image sensor cell while protecting the bonding pad structure from damage
TAIWAN SEMICONDUCTOR MFG58 citations96
US6495813B1Dec 17, 2002
Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process
TAIWAN SEMICONDUCTOR MFG60 citations95
US6956292B2Oct 18, 2005
Bumping process to increase bump height and to create a more robust bump structure
TAIWAN SEMICONDUCTOR MFG37 citations92
US6936923B2Aug 30, 2005
Method to form very a fine pitch solder bump using methods of electroplating
TAIWAN SEMICONDUCTOR MFG23 citations92
US6876049B2Apr 5, 2005
Colors only process to reduce package yield loss
TAIWAN SEMICONDUCTOR MFG12 citations92
US6649507B1Nov 18, 2003
Dual layer photoresist method for fabricating a mushroom bumping plating structure
TAIWAN SEMICONDUCTOR MFG33 citations92
US6583039B2Jun 24, 2003
Method of forming a bump on a copper pad
TAIWAN SEMICONDUCTOR MFG37 citations92
US6372545B1Apr 16, 2002
Method for under bump metal patterning of bumping process
TAIWAN SEMICONDUCTOR MFG22 citations92
US6200712B1Mar 13, 2001
Color filter image array optoelectronic microelectronic fabrication with three dimensional color filter layer and method for fabrication thereof
TAIWAN SEMICONDUCTOR MFG22 citations92
US6168966B1Jan 2, 2001
Fabrication of uniform areal sensitivity image array
TAIWAN SEMICONDUCTOR MFG35 citations92
US6486054B1Nov 26, 2002
Method to achieve robust solder bump height
TAIWAN SEMICONDUCTOR MFG25 citations91
US7183598B2Feb 27, 2007
Colors only process to reduce package yield loss
TAIWAN SEMICONDUCTOR MFG10 citations84
US6765277B2Jul 20, 2004
Microelectronic fabrication with corrosion inhibited bond pad
TAIWAN SEMICONDUCTOR MFG17 citations82
US6426283B1Jul 30, 2002
Method for bumping and backlapping a semiconductor wafer
TAIWAN SEMICONDUCTOR MFG10 citations74
US7816169B2Oct 19, 2010
Colors only process to reduce package yield loss
TAIWAN SEMICONDUCTOR MFG5 citations73
US7485906B2Feb 3, 2009
Colors only process to reduce package yield loss
TAIWAN SEMICONDUCTOR MFG2 citations63