P

Inventor

LANSFORD JEREMY

US13 patents

Patents

13 patents
US6567718B1May 20, 2003

Method and apparatus for monitoring consumable performance

ADVANCED MICRO DEVICES INC85 citations97
US6217412B1Apr 17, 2001

Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad

ADVANCED MICRO DEVICES INC71 citations96
US6213848B1Apr 10, 2001

Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer

ADVANCED MICRO DEVICES INC44 citations96
US6276989B1Aug 21, 2001

Method and apparatus for controlling within-wafer uniformity in chemical mechanical polishing

ADVANCED MICRO DEVICES INC56 citations95
US6746616B1Jun 8, 2004

Method and apparatus for providing etch uniformity using zoned temperature control

ADVANCED MICRO DEVICES INC43 citations92
US6511898B1Jan 28, 2003

Method for controlling deposition parameters based on polysilicon grain size feedback

ADVANCED MICRO DEVICES INC25 citations92
US6485990B1Nov 26, 2002

Feed-forward control of an etch processing tool

ADVANCED MICRO DEVICES INC19 citations92
US6352870B1Mar 5, 2002

Method of endpointing plasma strip process by measuring wafer temperature

ADVANCED MICRO DEVICES INC23 citations92
US6350179B2Feb 26, 2002

Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer

ADVANCED MICRO DEVICES INC31 citations92
US6157078ADec 5, 2000

Reduced variation in interconnect resistance using run-to-run control of chemical-mechanical polishing during semiconductor fabrication

ADVANCED MICRO DEVICES INC42 citations92
US6362116B1Mar 26, 2002

Method for controlling photoresist baking processes

ADVANCED MICRO DEVICES INC16 citations83
US6335286B1Jan 1, 2002

Feedback control of polish buff time as a function of scratch count

ADVANCED MICRO DEVICES INC14 citations83
US6291253B1Sep 18, 2001

Feedback control of deposition thickness based on polish planarization

ADVANCED MICRO DEVICES INC12 citations73