Inventor
AHN BYUNG HOON
SG14 patents
⚠️ This page may combine multiple inventors who share the name “AHN BYUNG HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST ASSEMBLY TEST SERVICES LTD
7 patentsUS7005325B2Feb 28, 2006
Semiconductor package with passive device integration
ST ASSEMBLY TEST SERVICES LTD99 citations98
US7960816B2Jun 14, 2011
Semiconductor package with passive device integration
ST ASSEMBLY TEST SERVICES LTD15 citations92
US7205651B2Apr 17, 2007
Thermally enhanced stacked die package and fabrication method
ST ASSEMBLY TEST SERVICES LTD45 citations92
US7064420B2Jun 20, 2006
Integrated circuit leadframe with ground plane
ST ASSEMBLY TEST SERVICES LTD28 citations92
US6858470B1Feb 22, 2005
Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof
ST ASSEMBLY TEST SERVICES LTD36 citations92
US7135760B2Nov 14, 2006
Moisture resistant integrated circuit leadframe package
ST ASSEMBLY TEST SERVICES LTD8 citations73
US7091596B2Aug 15, 2006
Semiconductor packages and leadframe assemblies
ST ASSEMBLY TEST SERVICES LTD6 citations73