Inventor
JANG SUNG SIK
KR10 patents
⚠️ This page may combine multiple inventors who share the name “JANG SUNG SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
8 patentsUS6525406B1Feb 25, 2003
Semiconductor device having increased moisture path and increased solder joint strength
AMKOR TECHNOLOGY INC69 citations95
US7042068B2May 9, 2006
Leadframe and semiconductor package made using the leadframe
AMKOR TECHNOLOGY INC32 citations92
US6555899B1Apr 29, 2003
Semiconductor package leadframe assembly and method of manufacture
AMKOR TECHNOLOGY INC34 citations92
US6853059B1Feb 8, 2005
Semiconductor package having improved adhesiveness and ground bonding
AMKOR TECHNOLOGY INC24 citations91
US6867071B1Mar 15, 2005
Leadframe including corner leads and semiconductor package using same
AMKOR TECHNOLOGY INC22 citations88
US7067908B2Jun 27, 2006
Semiconductor package having improved adhesiveness and ground bonding
AMKOR TECHNOLOGY INC9 citations72
US7535085B2May 19, 2009
Semiconductor package having improved adhesiveness and ground bonding
AMKOR TECHNOLOGY INC3 citations61
US9362210B2Jun 7, 2016
Leadframe and semiconductor package made using the leadframe
AMKOR TECHNOLOGY INC0 citations51