Inventor
HAMILTON BRANDON C
US21 patents
⚠️ This page may combine multiple inventors who share the name “HAMILTON BRANDON C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ROCKWELL COLLINS INC
15 patentsUS10454185B1Oct 22, 2019
Interferometric direction finding antenna
ROCKWELL COLLINS INC45 citations93
US11474576B1Oct 18, 2022
Electrical device with thermally controlled performance
ROCKWELL COLLINS INC3 citations67
US11233030B1Jan 25, 2022
Microfluidic manufactured mesoscopic microelectronics interconnect
ROCKWELL COLLINS INC1 citations61
US10727203B1Jul 28, 2020
Die-in-die-cavity packaging
ROCKWELL COLLINS INC1 citations60
US11462267B2Oct 4, 2022
System and device including memristor material
ROCKWELL COLLINS INC0 citations58
US11626286B1Apr 11, 2023
Custom photolithography masking via precision dispense process
ROCKWELL COLLINS INC0 citations56
US11605570B2Mar 14, 2023
Reconstituted wafer including integrated circuit die mechanically interlocked with mold material
ROCKWELL COLLINS INC0 citations48
US11515225B2Nov 29, 2022
Reconstituted wafer including mold material with recessed conductive feature
ROCKWELL COLLINS INC0 citations48
US11239182B2Feb 1, 2022
Controlled induced warping of electronic substrates
ROCKWELL COLLINS INC0 citations48
US11236436B2Feb 1, 2022
Controlled induced warping of electronic substrates via electroplating
ROCKWELL COLLINS INC0 citations48
US11631808B2Apr 18, 2023
System and device including memristor material
ROCKWELL COLLINS INC0 citations47
US11469373B2Oct 11, 2022
System and device including memristor material
ROCKWELL COLLINS INC0 citations47
US11456418B2Sep 27, 2022
System and device including memristor materials in parallel
ROCKWELL COLLINS INC0 citations47
US11749539B1Sep 5, 2023
Maskless etching of electronic substrates via precision dispense process
ROCKWELL COLLINS INC0 citations46
US11276641B1Mar 15, 2022
Conformal multi-plane material deposition
ROCKWELL COLLINS INC0 citations46