Inventor
HARRIES RICHARD J
US13 patents
⚠️ This page may combine multiple inventors who share the name “HARRIES RICHARD J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
7 patentsUS7294533B2Nov 13, 2007
Mold compound cap in a flip chip multi-matrix array package and process of making same
INTEL CORP24 citations86
US7387827B2Jun 17, 2008
Interconnection designs and materials having improved strength and fatigue life
INTEL CORP9 citations81
US10985080B2Apr 20, 2021
Electronic package that includes lamination layer
INTEL CORP0 citations59
US9793225B2Oct 17, 2017
Thermal expansion compensators for controlling microelectronic package warpage
INTEL CORP0 citations51
US7514300B2Apr 7, 2009
Mold compound cap in a flip chip multi-matrix array package and process of making same
INTEL CORP1 citations50
US10002814B2Jun 19, 2018
Apparatuses and methods to enhance passivation and ILD reliability
INTEL CORP0 citations49
US7719109B2May 18, 2010
Embedded capacitors for reducing package cracking
INTEL CORP0 citations49