Inventor
CHO YOUNG-SANG
KR31 patents
⚠️ This page may combine multiple inventors who share the name “CHO YOUNG-SANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
11 patentsUS6996305B2Feb 7, 2006
Printed circuit board with opto-via holes and process of forming the opto-via holes
SAMSUNG ELECTRO MECH32 citations92
US6839476B2Jan 4, 2005
Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board
SAMSUNG ELECTRO MECH32 citations92
US7033457B2Apr 25, 2006
Method of attaching optical waveguide component to printed circuit board
SAMSUNG ELECTRO MECH13 citations84
US6905569B2Jun 14, 2005
Method of embedding optical fiber in multilayer printed circuit board
SAMSUNG ELECTRO MECH13 citations84
US6879423B2Apr 12, 2005
Printed circuit board assembly with multi-channel block-type optical devices packaged therein
SAMSUNG ELECTRO MECH11 citations74
US7197202B2Mar 27, 2007
Optical printed circuit board for long-distance signal transmission
SAMSUNG ELECTRO MECH7 citations73
US7025849B2Apr 11, 2006
Method of attaching optical waveguide component to printed circuit board
SAMSUNG ELECTRO MECH9 citations73
US6978058B2Dec 20, 2005
Multi-layer PCB and method for coupling block type multichannel optical signals
SAMSUNG ELECTRO MECH7 citations73
US7046870B2May 16, 2006
Method of fabricating multi-layered printed circuit board for optical waveguides
SAMSUNG ELECTRO MECH4 citations62
US6882161B2Apr 19, 2005
Method of measuring dielectric constant of PCB for RIMM
SAMSUNG ELECTRO MECH4 citations62
US7350295B2Apr 1, 2008
Method of fabricating multi-layered printed circuit board for optical waveguides
SAMSUNG ELECTRO MECH0 citations52
SAMSUNG ELECTRONICS CO LTD
9 patentsUS7915727B2Mar 29, 2011
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
SAMSUNG ELECTRONICS CO LTD8 citations82
US10705155B2Jul 7, 2020
Memory systems and power management apparatuses including secondary power devices, and related methods of operation
SAMSUNG ELECTRONICS CO LTD4 citations72
US11205604B2Dec 21, 2021
Semiconductor package including a thermal conductive layer and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US9356450B2May 31, 2016
Power supply circuits with discharge capability and methods of operating same
SAMSUNG ELECTRONICS CO LTD5 citations71
US7589421B2Sep 15, 2009
Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US7508680B2Mar 24, 2009
Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate
SAMSUNG ELECTRONICS CO LTD2 citations62
US8952510B2Feb 10, 2015
Semiconductor chip and film and tab package comprising the chip and film
SAMSUNG ELECTRONICS CO LTD3 citations61
US7768103B2Aug 3, 2010
Tape distribution substrate having pattern for reducing EMI
SAMSUNG ELECTRONICS CO LTD1 citations52
US7560805B2Jul 14, 2009
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
KOREA INST SCI & TECH
3 patentsUS6409983B1Jun 25, 2002
Process for preparing crystalline barium titanate powder
KOREA INST SCI & TECH21 citations89
US6811704B2Nov 2, 2004
Method for anion removal by forming chemical precipitation under an electric field and continuous process for anion removal
KOREA INST SCI & TECH6 citations67
US10030496B2Jul 24, 2018
Method for producing synthetic gas by using solid acid
KOREA INST SCI & TECH0 citations50
CHO YOUNG-SANG
3 patentsUS8575735B2Nov 5, 2013
Semiconductor chip and film and TAB package comprising the chip and film
CHO YOUNG-SANG6 citations80
US8506703B2Aug 13, 2013
Method and apparatus for forming colloidal photonic crystals
CHO YOUNG-SANG0 citations51
US9129972B2Sep 8, 2015
Semiconductor package
CHO YOUNG-SANG1 citations50