Inventor
OGGIONI STEFANO SERGIO
IT25 patents
⚠️ This page may combine multiple inventors who share the name “OGGIONI STEFANO SERGIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS7788801B2Sep 7, 2010
Method for manufacturing a tamper-proof cap for an electronic module
IBM23 citations92
US7703201B2Apr 27, 2010
Method of embedding tamper proof layers and discrete components into printed circuit board stack-up
IBM27 citations92
US7915540B2Mar 29, 2011
Tamper-proof structures for protecting electronic modules
IBM12 citations83
US7015574B2Mar 21, 2006
Electronic device carrier adapted for transmitting high frequency signals
IBM11 citations80
US11244079B2Feb 8, 2022
Data detection mitigation in printed circuit boards
IBM2 citations72
US6617698B2Sep 9, 2003
Reworkable and thermally conductive adhesive and use thereof
IBM11 citations72
US11822707B2Nov 21, 2023
Secure ventilation through protective flexible sensors
IBM0 citations62
US10496851B1Dec 3, 2019
Secure signal integrity
IBM1 citations62
US8870472B2Oct 28, 2014
Computer program product for electro-optical assembly
IBM2 citations62
US7783998B2Aug 24, 2010
Method and system for prototyping electronic devices with multi-configuration CHIP carriers
IBM2 citations62
US6777817B2Aug 17, 2004
Reworkable and thermally conductive adhesive and use thereof
IBM2 citations61
US7523547B2Apr 28, 2009
Method for attaching a flexible structure to a device and a device having a flexible structure
IBM3 citations60
US10762243B1Sep 1, 2020
Secure signal integrity
IBM0 citations52
US9323009B2Apr 26, 2016
Computer program product for electro-optical assembly
IBM0 citations52
US9274289B2Mar 1, 2016
Fabricating an optical assembly
IBM0 citations52
US8926197B2Jan 6, 2015
Method for fabricating an electro-optical assembly
IBM0 citations52
US9397042B2Jul 19, 2016
Integrated helical multi-layer inductor structures
IBM1 citations51
US10622295B2Apr 14, 2020
Circuitized substrate with electronic components mounted on transversal portion thereof
IBM0 citations49
US10622296B2Apr 14, 2020
Circuitized substrate with electronic components mounted on transversal portion thereof
IBM0 citations49
US10068839B2Sep 4, 2018
Circuitized substrate with electronic components mounted on transversal portion thereof
IBM0 citations49
US10008474B2Jun 26, 2018
Dense assembly of laterally soldered, overmolded chip packages
IBM0 citations39
US7524698B2Apr 28, 2009
Handling and positioning of metallic plated balls for socket application in ball grid array packages
IBM0 citations39