Inventor
HOZOJI HIROSHI
JP62 patents
⚠️ This page may combine multiple inventors who share the name “HOZOJI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
37 patentsUS5068712ANov 26, 1991
Semiconductor device
HITACHI LTD165 citations99
US6791178B2Sep 14, 2004
Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices
HITACHI LTD77 citations98
US6780748B2Aug 24, 2004
Method of fabricating a wafer level chip size package utilizing a maskless exposure
HITACHI LTD150 citations98
US6744135B2Jun 1, 2004
Electronic apparatus
HITACHI LTD104 citations98
US6610934B2Aug 26, 2003
Semiconductor module and method of making the device
HITACHI LTD67 citations96
US6081023AJun 27, 2000
Semiconductor device
HITACHI LTD28 citations96
US5793099AAug 11, 1998
Semiconductor device
HITACHI LTD30 citations96
US5612569AMar 18, 1997
Semiconductor device
HITACHI LTD35 citations96
US5530286AJun 25, 1996
Semiconductor device
HITACHI LTD53 citations96
US5358904AOct 25, 1994
Semiconductor device
HITACHI LTD47 citations96
US7504720B2Mar 17, 2009
Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
HITACHI LTD38 citations93
US7393771B2Jul 1, 2008
Method for mounting an electronic part on a substrate using a liquid containing metal particles
HITACHI LTD33 citations93
US6130114AOct 10, 2000
Semiconductor device
HITACHI LTD17 citations93
US6100580AAug 8, 2000
Semiconductor device having all outer leads extending from one side of a resin member
HITACHI LTD17 citations93
US6018191AJan 25, 2000
Semiconductor device
HITACHI LTD18 citations93
US7589400B2Sep 15, 2009
Inverter and vehicle drive unit using the same
HITACHI LTD29 citations92
US7425762B2Sep 16, 2008
Electronic apparatus
HITACHI LTD15 citations92
US7145231B2Dec 5, 2006
Electronic apparatus
HITACHI LTD26 citations92
US7057283B2Jun 6, 2006
Semiconductor device and method for producing the same
HITACHI LTD26 citations92
US6624504B1Sep 23, 2003
Semiconductor device and method for manufacturing the same
HITACHI LTD43 citations92
US8050037B2Nov 1, 2011
Electronic control device using LC module structure
HITACHI LTD15 citations84
US7955411B2Jun 7, 2011
Low temperature bonding material comprising metal particles and bonding method
HITACHI LTD13 citations84
US7816786B2Oct 19, 2010
Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
HITACHI LTD12 citations84
US7528485B2May 5, 2009
Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
HITACHI LTD13 citations84
US7172130B2Feb 6, 2007
Electronic device, rubber product, and methods for manufacturing the same
HITACHI LTD15 citations84
US7542317B2Jun 2, 2009
Semiconductor device and power conversion apparatus using the same
HITACHI LTD16 citations83
US6326681B1Dec 4, 2001
Semiconductor device
HITACHI LTD14 citations82
US6303982B2Oct 16, 2001
Semiconductor device
HITACHI LTD10 citations82
US6072231AJun 6, 2000
Semiconductor device
HITACHI LTD12 citations82
US6069029AMay 30, 2000
Semiconductor device chip on lead and lead on chip manufacturing
HITACHI LTD13 citations82
US5981315ANov 9, 1999
Semiconductor device
HITACHI LTD7 citations82
US5914530AJun 22, 1999
Semiconductor device
HITACHI LTD15 citations82
US5863817AJan 26, 1999
Semiconductor device
HITACHI LTD7 citations82
US5821606AOct 13, 1998
Semiconductor device
HITACHI LTD9 citations82
US6124629ASep 26, 2000
Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip
HITACHI LTD3 citations74
US5225499AJul 6, 1993
Resin composition for encapsulating of semiconductor and semiconductor apparatus using of the same
HITACHI LTD8 citations74
US9373558B2Jun 21, 2016
Resin-sealed electronic control device
HITACHI LTD3 citations73
RENESAS TECH CORP
6 patentsUS6930388B2Aug 16, 2005
Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure
RENESAS TECH CORP37 citations92
US6822317B1Nov 23, 2004
Semiconductor apparatus including insulating layer having a protrusive portion
RENESAS TECH CORP37 citations92
US6770547B1Aug 3, 2004
Method for producing a semiconductor device
RENESAS TECH CORP40 citations92
US7002250B2Feb 21, 2006
Semiconductor module
RENESAS TECH CORP14 citations81
US7084498B2Aug 1, 2006
Semiconductor device having projected electrodes and structure for mounting the same
RENESAS TECH CORP9 citations74
US6720208B2Apr 13, 2004
Semiconductor device
RENESAS TECH CORP2 citations74
HITACHI AUTOMOTIVE SYSTEMS LTD
3 patentsUS10348214B2Jul 9, 2019
Power module, power converter device, and electrically powered vehicle
HITACHI AUTOMOTIVE SYSTEMS LTD13 citations92
US9729076B2Aug 8, 2017
Power module, power converter device, and electrically powered vehicle
HITACHI AUTOMOTIVE SYSTEMS LTD5 citations84
US9407163B2Aug 2, 2016
Power module, power converter device, and electrically powered vehicle
HITACHI AUTOMOTIVE SYSTEMS LTD4 citations84
NAKATSU KINYA
1 patentHORIUCHI KEISUKE
1 patentHITACHI ASTEMO LTD
1 patent(unassigned)
1 patentShowing the top 50 of 62 patents by PatentIndex Score.