Inventor
YU BIN
CN640 patents
⚠️ This page may combine multiple inventors who share the name “YU BIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
49 patentsUS6921963B2Jul 26, 2005
Narrow fin FinFET
ADVANCED MICRO DEVICES INC273 citations99
US6897527B2May 24, 2005
Strained channel FinFET
ADVANCED MICRO DEVICES INC118 citations99
US6872647B1Mar 29, 2005
Method for forming multiple fins in a semiconductor device
ADVANCED MICRO DEVICES INC186 citations99
US6835618B1Dec 28, 2004
Epitaxially grown fin for FinFET
ADVANCED MICRO DEVICES INC229 citations99
US6833588B2Dec 21, 2004
Semiconductor device having a U-shaped gate structure
ADVANCED MICRO DEVICES INC116 citations99
US6803631B2Oct 12, 2004
Strained channel finfet
ADVANCED MICRO DEVICES INC152 citations99
US6787424B1Sep 7, 2004
Fully depleted SOI transistor with elevated source and drain
ADVANCED MICRO DEVICES INC155 citations99
US6784101B1Aug 31, 2004
Formation of high-k gate dielectric layers for MOS devices fabricated on strained lattice semiconductor substrates with minimized stress relaxation
ADVANCED MICRO DEVICES INC205 citations99
US6764884B1Jul 20, 2004
Method for forming a gate in a FinFET device and thinning a fin in a channel region of the FinFET device
ADVANCED MICRO DEVICES INC244 citations99
US6762448B1Jul 13, 2004
FinFET device with multiple fin structures
ADVANCED MICRO DEVICES INC168 citations99
US6709982B1Mar 23, 2004
Double spacer FinFET formation
ADVANCED MICRO DEVICES INC272 citations99
US6706571B1Mar 16, 2004
Method for forming multiple structures in a semiconductor device
ADVANCED MICRO DEVICES INC836 citations99
US6693333B1Feb 17, 2004
Semiconductor-on-insulator circuit with multiple work functions
ADVANCED MICRO DEVICES INC212 citations99
US6686231B1Feb 3, 2004
Damascene gate process with sacrificial oxide in semiconductor devices
ADVANCED MICRO DEVICES INC116 citations99
US6682973B1Jan 27, 2004
Formation of well-controlled thin SiO, SiN, SiON layer for multilayer high-K dielectric applications
ADVANCED MICRO DEVICES INC595 citations99
US6670260B1Dec 30, 2003
Transistor with local insulator structure
ADVANCED MICRO DEVICES INC124 citations99
US6657276B1Dec 2, 2003
Shallow trench isolation (STI) region with high-K liner and method of formation
ADVANCED MICRO DEVICES INC198 citations99
US6646307B1Nov 11, 2003
MOSFET having a double gate
ADVANCED MICRO DEVICES INC1,496 citations99
US6645797B1Nov 11, 2003
Method for forming fins in a FinFET device using sacrificial carbon layer
ADVANCED MICRO DEVICES INC273 citations99
US6611029B1Aug 26, 2003
Double gate semiconductor device having separate gates
ADVANCED MICRO DEVICES INC264 citations99
US6562665B1May 13, 2003
Fabrication of a field effect transistor with a recess in a semiconductor pillar in SOI technology
ADVANCED MICRO DEVICES INC333 citations99
US6551885B1Apr 22, 2003
Low temperature process for a thin film transistor
ADVANCED MICRO DEVICES INC169 citations99
US6552377B1Apr 22, 2003
Mos transistor with dual metal gate structure
ADVANCED MICRO DEVICES INC146 citations99
US6534373B1Mar 18, 2003
MOS transistor with reduced floating body effect
ADVANCED MICRO DEVICES INC150 citations99
US6528858B1Mar 4, 2003
MOSFETs with differing gate dielectrics and method of formation
ADVANCED MICRO DEVICES INC162 citations99
US6504214B1Jan 7, 2003
MOSFET device having high-K dielectric layer
ADVANCED MICRO DEVICES INC160 citations99
US6475869B1Nov 5, 2002
Method of forming a double gate transistor having an epitaxial silicon/germanium channel region
ADVANCED MICRO DEVICES INC765 citations99
US6475890B1Nov 5, 2002
Fabrication of a field effect transistor with an upside down T-shaped semiconductor pillar in SOI technology
ADVANCED MICRO DEVICES INC271 citations99
US6458662B1Oct 1, 2002
Method of fabricating a semiconductor device having an asymmetrical dual-gate silicon-germanium (SiGe) channel MOSFET and a device thereby formed
ADVANCED MICRO DEVICES INC256 citations99
US6429484B1Aug 6, 2002
Multiple active layer structure and a method of making such a structure
ADVANCED MICRO DEVICES INC373 citations99
US6391753B1May 21, 2002
Process for forming gate conductors
ADVANCED MICRO DEVICES INC212 citations99
US6391782B1May 21, 2002
Process for forming multiple active lines and gate-all-around MOSFET
ADVANCED MICRO DEVICES INC188 citations99
US6380019B1Apr 30, 2002
Method of manufacturing a transistor with local insulator structure
ADVANCED MICRO DEVICES INC150 citations99
US6312995B1Nov 6, 2001
MOS transistor with assisted-gates and ultra-shallow “Psuedo” source and drain extensions for ultra-large-scale integration
ADVANCED MICRO DEVICES INC274 citations99
US6221724B1Apr 24, 2001
Method of fabricating an integrated circuit having punch-through suppression
ADVANCED MICRO DEVICES INC156 citations99
US6066533AMay 23, 2000
MOS transistor with dual metal gate structure
ADVANCED MICRO DEVICES INC196 citations99
US7250645B1Jul 31, 2007
Reversed T-shaped FinFET
ADVANCED MICRO DEVICES INC74 citations98
US6998301B1Feb 14, 2006
Method for forming a tri-gate MOSFET
ADVANCED MICRO DEVICES INC70 citations98
US6855607B2Feb 15, 2005
Multi-step chemical mechanical polishing of a gate area in a FinFET
ADVANCED MICRO DEVICES INC70 citations98
US6855583B1Feb 15, 2005
Method for forming tri-gate FinFET with mesa isolation
ADVANCED MICRO DEVICES INC126 citations98
US6787854B1Sep 7, 2004
Method for forming a fin in a finFET device
ADVANCED MICRO DEVICES INC113 citations98
US6787406B1Sep 7, 2004
Systems and methods for forming dense n-channel and p-channel fins using shadow implanting
ADVANCED MICRO DEVICES INC86 citations98
US6787402B1Sep 7, 2004
Double-gate vertical MOSFET transistor and fabrication method
ADVANCED MICRO DEVICES INC130 citations98
US6762483B1Jul 13, 2004
Narrow fin FinFET
ADVANCED MICRO DEVICES INC110 citations98
US6716690B1Apr 6, 2004
Uniformly doped source/drain junction in a double-gate MOSFET
ADVANCED MICRO DEVICES INC137 citations98
US6716686B1Apr 6, 2004
Method for forming channels in a finfet device
ADVANCED MICRO DEVICES INC85 citations98
US6689671B1Feb 10, 2004
Low temperature solid-phase epitaxy fabrication process for MOS devices built on strained semiconductor substrate
ADVANCED MICRO DEVICES INC145 citations98
US6642122B1Nov 4, 2003
Dual laser anneal for graded halo profile
ADVANCED MICRO DEVICES INC95 citations98
US6555879B1Apr 29, 2003
SOI device with metal source/drain and method of fabrication
ADVANCED MICRO DEVICES INC135 citations98
ADVANCE MICRO DEVICES INC
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