P

Inventor

TSANG KWOK CHEUNG

US25 patents
⚠️ This page may combine multiple inventors who share the name “TSANG KWOK CHEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ASAT LTD

18 patents
US7372151B1May 13, 2008

Ball grid array package and process for manufacturing same

ASAT LTD461 citations99
US7009286B1Mar 7, 2006

Thin leadless plastic chip carrier

ASAT LTD117 citations99
US6995460B1Feb 7, 2006

Leadless plastic chip carrier with etch back pad singulation

ASAT LTD119 citations99
US6989294B1Jan 24, 2006

Leadless plastic chip carrier with etch back pad singulation

ASAT LTD101 citations99
US6635957B2Oct 21, 2003

Leadless plastic chip carrier with etch back pad singulation and die attach pad array

ASAT LTD199 citations99
US7482690B1Jan 27, 2009

Electronic components such as thin array plastic packages and process for fabricating same

ASAT LTD86 citations98
US6964918B1Nov 15, 2005

Electronic components such as thin array plastic packages and process for fabricating same

ASAT LTD84 citations98
US6933594B2Aug 23, 2005

Leadless plastic chip carrier with etch back pad singulation

ASAT LTD140 citations98
US7358119B2Apr 15, 2008

Thin array plastic package without die attach pad and process for fabricating the same

ASAT LTD78 citations97
US6781242B1Aug 24, 2004

Thin ball grid array package

ASAT LTD91 citations97
US6586834B1Jul 1, 2003

Die-up tape ball grid array package

ASAT LTD78 citations95
US6429048B1Aug 6, 2002

Metal foil laminated IC package

ASAT LTD78 citations94
US7270867B1Sep 18, 2007

Leadless plastic chip carrier

ASAT LTD34 citations92
US7271032B1Sep 18, 2007

Leadless plastic chip carrier with etch back pad singulation

ASAT LTD43 citations92
US7232755B1Jun 19, 2007

Process for fabricating pad frame and integrated circuit package

ASAT LTD20 citations92
US7081403B1Jul 25, 2006

Thin leadless plastic chip carrier

ASAT LTD28 citations92
US6872661B1Mar 29, 2005

Leadless plastic chip carrier with etch back pad singulation and die attach pad array

ASAT LTD53 citations92
US7439099B1Oct 21, 2008

Thin ball grid array package

ASAT LTD3 citations62

LIN GERALDINE TSUI YEE

2 patents

MCLELLAN NEIL

1 patent

LI TUNG LOK

1 patent

UTAC HONG KONG LTD

1 patent

BROADCOM CORP

1 patent

AVAGO TECH INT SALES PTE LID

1 patent