Inventor
LEE SONG-BOR
TW25 patents
⚠️ This page may combine multiple inventors who share the name “LEE SONG-BOR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
20 patentsUS11881530B2Jan 23, 2024
Spacer structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11233119B2Jan 25, 2022
Core-shell nanostructures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11233149B2Jan 25, 2022
Spacer structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11101360B2Aug 24, 2021
Method of manufacturing a semiconductor device and a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9122828B2Sep 1, 2015
Apparatus and method for designing an integrated circuit layout having a plurality of cell technologies
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US11929422B2Mar 12, 2024
Passivation layers for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11695055B2Jul 4, 2023
Passivation layers for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11621343B2Apr 4, 2023
Method of manufacturing semiconductor devices and semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11075269B2Jul 27, 2021
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations68
US12581677B2Mar 17, 2026
Passivation layers for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12432986B2Sep 30, 2025
Spacer structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12426322B2Sep 23, 2025
Core-shell nanostructures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12040381B2Jul 16, 2024
Method of manufacturing semiconductor devices and semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11824089B2Nov 21, 2023
Core-shell nanostructures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11069791B2Jul 20, 2021
Method of manufacturing semiconductor devices and semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11961762B2Apr 16, 2024
Package component with stepped passivation layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11450567B2Sep 20, 2022
Package component with stepped passivation layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US11990510B2May 21, 2024
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US9443721B2Sep 13, 2016
Wafer back side processing structure and apparatus
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9406559B2Aug 2, 2016
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations40
TAIWAN SEMICONDUCTOR MFG
3 patentsUS7825024B2Nov 2, 2010
Method of forming through-silicon vias
TAIWAN SEMICONDUCTOR MFG170 citations98
US9123673B2Sep 1, 2015
Wafer back side processing structure and apparatus
TAIWAN SEMICONDUCTOR MFG1 citations51
US9009639B2Apr 14, 2015
Method and system for enhanced integrated circuit layout
TAIWAN SEMICONDUCTOR MFG1 citations49