Inventor
SHOJAIE SAEED
US4 patents
Patents
4 patentsUS7141452B2Nov 28, 2006
Methods of reducing bleed-out of underfill and adhesive materials
INTEL CORP11 citations81
US7372133B2May 13, 2008
Microelectronic package having a stiffening element and method of making same
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US10847450B2Nov 24, 2020
Compact wirebonding in stacked-chip system in package, and methods of making same
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US9773764B2Sep 26, 2017
Solid state device miniaturization
INTEL CORP1 citations49