Inventor
LIU CHIA-WEI
TW76 patents
⚠️ This page may combine multiple inventors who share the name “LIU CHIA-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
30 patentsUS10679889B2Jun 9, 2020
Method for manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11489011B2Nov 1, 2022
Resistive random access memory device
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations82
US11011576B2May 18, 2021
Resistive random access memory device
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations82
US12448279B2Oct 21, 2025
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12453298B2Oct 21, 2025
Resistive random access memory device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12415718B2Sep 16, 2025
Impact-resistant micromechanical arms
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12400947B2Aug 26, 2025
Variable graduated capacitor structure and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261129B2Mar 25, 2025
Damping device and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237280B2Feb 25, 2025
Cavity resonator for enhancing radio-frequency performance and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12239034B2Feb 25, 2025
Resistive random access memory device having needle-like-shaped top electrode region and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12205901B2Jan 21, 2025
Plasma-damage-resistant interconnect structure and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12191247B2Jan 7, 2025
Variable graduated capacitor structure and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12165868B2Dec 10, 2024
Semiconductor device in a containment structure including a buried layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12131915B2Oct 29, 2024
Pit-less chemical mechanical planarization process and device structures made therefrom
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12027431B2Jul 2, 2024
Semiconductor structure and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11914915B2Feb 27, 2024
Near eye display apparatus
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11892639B2Feb 6, 2024
Display device having display area with luminous pixels over curved surface of semiconductor substrate for use in near-eye display
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11848291B2Dec 19, 2023
Cavity resonator for enhancing radio-frequency performance and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11728272B2Aug 15, 2023
Plasma-damage-resistant interconnect structure and methods for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11710632B2Jul 25, 2023
Method of manufacturing at least one semiconductor device on or in a base semiconductor material disposed in a containment structure including a buried layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11705340B2Jul 18, 2023
Pit-less chemical mechanical planarization process and device structures made therefrom
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11587824B2Feb 21, 2023
Method for manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11476288B2Oct 18, 2022
Infrared image sensor component manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11127625B2Sep 21, 2021
Semiconductor structure and related method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10438838B2Oct 8, 2019
Semiconductor structure and related method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9281336B2Mar 8, 2016
Mechanisms for forming backside illuminated image sensor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US12396179B2Aug 19, 2025
Resistive random access memory device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11950433B2Apr 2, 2024
Resistive random access memory device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11678592B2Jun 13, 2023
Step height mitigation in resistive random access memory structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11038108B2Jun 15, 2021
Step height mitigation in resistive random access memory structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
NETGEAR INC
9 patentsUS9516540B2Dec 6, 2016
Systems and methods for implementing a wireless device that supports WLAN modules operating simultaneously in different wireless bands
NETGEAR INC10 citations93
US9439099B2Sep 6, 2016
Systems and methods for simultaneously using multiple WLAN modules operating in different wireless bands
NETGEAR INC9 citations93
US9923581B2Mar 20, 2018
Front-end module and antenna design for a wireless device simultaneously using WLAN modules operating in different wireless bands
NETGEAR INC5 citations84
US9402199B2Jul 26, 2016
Systems and methods for wireless load balancing and channel selection for a wireless device using WLAN modules operating simultaneously in different wireless bands
NETGEAR INC6 citations84
US10236578B2Mar 19, 2019
Antenna structures and associated methods for construction and use
NETGEAR INC2 citations72
US11621731B2Apr 4, 2023
Client wireless device that merges functions of upper and lower MAC layers to support WLAN modules operating simultaneously in different wireless bands
NETGEAR INC0 citations63
US10911072B2Feb 2, 2021
Systems and methods for wireless load balancing and channel selection for a wireless device using WLAN modules operating simultaneously in different wireless bands
NETGEAR INC0 citations63
US9948326B2Apr 17, 2018
Systems and methods for implementing a wireless device that supports WLAN modules operating simultaneously in different wireless bands
NETGEAR INC1 citations63
US10236585B2Mar 19, 2019
Isolated multiband tubular dipole
NETGEAR INC1 citations61
UNITED MICROELECTRONICS CORP
5 patentsUS12243839B2Mar 4, 2025
Bonded semiconductor structure utilizing concave/convex profile design for bonding pads
UNITED MICROELECTRONICS CORP0 citations61
US12178136B2Dec 24, 2024
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US11935854B2Mar 19, 2024
Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads
UNITED MICROELECTRONICS CORP0 citations61
US11778917B2Oct 3, 2023
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US11640949B2May 2, 2023
Bonded semiconductor structure utilizing concave/convex profile design for bonding pads
UNITED MICROELECTRONICS CORP0 citations61
TAIWAN SEMICONDUCTOR MFG
3 patentsUS7301185B2Nov 27, 2007
High-voltage transistor device having an interlayer dielectric etch stop layer for preventing leakage and improving breakdown voltage
TAIWAN SEMICONDUCTOR MFG34 citations90
US9177914B2Nov 3, 2015
Metal pad structure over TSV to reduce shorting of upper metal layer
TAIWAN SEMICONDUCTOR MFG5 citations80
US7498653B2Mar 3, 2009
Semiconductor structure for isolating integrated circuits of various operating voltages
TAIWAN SEMICONDUCTOR MFG3 citations61
HON HAI PREC IND CO LTD
1 patentDELTA ELECTRONIC INC
1 patentUNIV OHIO STATE
1 patentShowing the top 50 of 76 patents by PatentIndex Score.