Inventor
LIANG CHIA WEN
TW30 patents
⚠️ This page may combine multiple inventors who share the name “LIANG CHIA WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
26 patentsUS5940714AAug 17, 1999
Method of fabricating a capacitor electrode structure in integrated circuit through self-aligned process
UNITED MICROELECTRONICS CORP33 citations91
US5683922ANov 4, 1997
Method of fabricating a self-aligned contact
UNITED MICROELECTRONICS CORP32 citations86
US7622344B2Nov 24, 2009
Method of manufacturing complementary metal oxide semiconductor transistors
UNITED MICROELECTRONICS CORP14 citations84
US6121085ASep 19, 2000
Method of fabricating contact openings for dynamic random-access memory
UNITED MICROELECTRONICS CORP18 citations84
US6030867AFeb 29, 2000
Method of fabricating a Fin/HSG DRAM cell capacitor
UNITED MICROELECTRONICS CORP16 citations84
US5989953ANov 23, 1999
Method for manufacturing DRAM capacitor
UNITED MICROELECTRONICS CORP17 citations84
US8952451B2Feb 10, 2015
Semiconductor device having metal gate and manufacturing method thereof
UNITED MICROELECTRONICS CORP5 citations83
US6074955AJun 13, 2000
Method of fabricating a node contact window of DRAM
UNITED MICROELECTRONICS CORP11 citations74
US6153513ANov 28, 2000
Method of fabricating self-aligned capacitor
UNITED MICROELECTRONICS CORP8 citations72
US7176551B2Feb 13, 2007
Fuse structure for a semiconductor device
UNITED MICROELECTRONICS CORP9 citations70
US7682890B2Mar 23, 2010
Method of fabricating semiconductor device
UNITED MICROELECTRONICS CORP2 citations63
US7585790B2Sep 8, 2009
Method for forming semiconductor device
UNITED MICROELECTRONICS CORP2 citations63
US7485517B2Feb 3, 2009
Fabricating method of semiconductor device
UNITED MICROELECTRONICS CORP3 citations63
US6090695AJul 18, 2000
Method for forming self-aligned landing pads
UNITED MICROELECTRONICS CORP2 citations63
US5924007AJul 13, 1999
Method for improving the planarization of inter-poly dielectric
UNITED MICROELECTRONICS CORP2 citations63
US7566932B2Jul 28, 2009
Static random access memory unit
UNITED MICROELECTRONICS CORP2 citations62
US7190044B1Mar 13, 2007
Fuse structure for a semiconductor device
UNITED MICROELECTRONICS CORP3 citations62
US6096594AAug 1, 2000
Fabricating method of a dynamic random access memory
UNITED MICROELECTRONICS CORP6 citations62
US6001743ADec 14, 1999
Method for fabricating a self-aligned contact
UNITED MICROELECTRONICS CORP3 citations54
US9312359B2Apr 12, 2016
Semiconductor structure and fabrication method thereof
UNITED MICROELECTRONICS CORP0 citations52
US7550356B2Jun 23, 2009
Method of fabricating strained-silicon transistors
UNITED MICROELECTRONICS CORP1 citations52
US7465640B2Dec 16, 2008
Dynamic random access memory cell and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations52
US7335933B2Feb 26, 2008
Dynamic random access memory cell and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations52
US8999830B2Apr 7, 2015
Semiconductor device having metal gate and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations51
US6150218ANov 21, 2000
Method for simutaneously forming bit-line contacts and node contacts
UNITED MICROELECTRONICS CORP0 citations51
US7582520B2Sep 1, 2009
Method of fabricating complementary metal-oxide-semiconductor transistor and metal-oxide-semiconductor transistor
UNITED MICROELECTRONICS CORP0 citations41