Inventor
TZENG KUO-CHYUAN
TW44 patents
⚠️ This page may combine multiple inventors who share the name “TZENG KUO-CHYUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
23 patentsUS6620679B1Sep 16, 2003
Method to integrate high performance 1T ram in a CMOS process using asymmetric structure
TAIWAN SEMICONDUCTOR MFG61 citations95
US6661049B2Dec 9, 2003
Microelectronic capacitor structure embedded within microelectronic isolation region
TAIWAN SEMICONDUCTOR MFG21 citations92
US6638813B1Oct 28, 2003
Method of forming a composite spacer to eliminate polysilicon stringers between elements in a pseudo SRAM cell
TAIWAN SEMICONDUCTOR MFG33 citations92
US6383863B1May 7, 2002
Approach to integrate salicide gate for embedded DRAM devices
TAIWAN SEMICONDUCTOR MFG38 citations92
US6143621ANov 7, 2000
Capacitor circuit structure for determining overlay error
TAIWAN SEMICONDUCTOR MFG44 citations92
US7091543B2Aug 15, 2006
Embedded dual-port DRAM process
TAIWAN SEMICONDUCTOR MFG38 citations91
US6613690B1Sep 2, 2003
Approach for forming a buried stack capacitor structure featuring reduced polysilicon stringers
TAIWAN SEMICONDUCTOR MFG29 citations88
US9257409B2Feb 9, 2016
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG5 citations84
US6207492B1Mar 27, 2001
Common gate and salicide word line process for low cost embedded DRAM devices
TAIWAN SEMICONDUCTOR MFG17 citations84
US7271083B2Sep 18, 2007
One-transistor random access memory technology compatible with metal gate process
TAIWAN SEMICONDUCTOR MFG15 citations83
US6242757B1Jun 5, 2001
Capacitor circuit structure for determining overlay error
TAIWAN SEMICONDUCTOR MFG15 citations83
US6661050B2Dec 9, 2003
Memory cell structure with trench capacitor and method for fabrication thereof
TAIWAN SEMICONDUCTOR MFG10 citations74
US6569732B1May 27, 2003
Integrated process sequence allowing elimination of polysilicon residue and silicon damage during the fabrication of a buried stack capacitor structure in a SRAM cell
TAIWAN SEMICONDUCTOR MFG12 citations74
US6376294B1Apr 23, 2002
Method to define poly dog-bone for word line strapping contact at stitch area in embedded DRAM process
TAIWAN SEMICONDUCTOR MFG10 citations74
US6794254B1Sep 21, 2004
Embedded dual-port DRAM process
TAIWAN SEMICONDUCTOR MFG10 citations72
US9269762B2Feb 23, 2016
Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers
TAIWAN SEMICONDUCTOR MFG1 citations63
US9263415B2Feb 16, 2016
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG1 citations63
US6713406B1Mar 30, 2004
Method for depositing dielectric materials onto semiconductor substrates by HDP (high density plasma) CVD (chemical vapor deposition) processes without damage to FET active devices
TAIWAN SEMICONDUCTOR MFG5 citations63
US6306767B1Oct 23, 2001
Self-aligned etching method for forming high areal density patterned microelectronic structures
TAIWAN SEMICONDUCTOR MFG2 citations62
US7884408B2Feb 8, 2011
One-transistor random access memory technology compatible with metal gate process
TAIWAN SEMICONDUCTOR MFG4 citations61
US6670664B1Dec 30, 2003
Single transistor random access memory (1T-RAM) cell with dual threshold voltages
TAIWAN SEMICONDUCTOR MFG5 citations58
US8994146B2Mar 31, 2015
Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers
TAIWAN SEMICONDUCTOR MFG0 citations52
US8993405B2Mar 31, 2015
Method of fabricating metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers
TAIWAN SEMICONDUCTOR MFG0 citations52
TAIWAN SEMICONDUCTOR MFG CO LTD
16 patentsUS10483119B1Nov 19, 2019
Self-aligned double patterning (SADP) method
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations83
US10818505B2Oct 27, 2020
Self-aligned double patterning process and semiconductor structure formed using thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9401395B2Jul 26, 2016
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12048258B2Jul 23, 2024
Phase change memory device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11676822B2Jun 13, 2023
Self-aligned double patterning process and semiconductor structure formed using thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12484459B2Nov 25, 2025
Planarization-less phase change material switch
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12387786B2Aug 12, 2025
Bit line and word line connection for memory array
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11715519B2Aug 1, 2023
Bit line and word line connection for memory array
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11211120B2Dec 28, 2021
Bit line and word line connection for memory array
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10872777B2Dec 22, 2020
Self-aligned double patterning (SADP) method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12302767B2May 13, 2025
Buffer layer in memory cell to prevent metal redeposition
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11532785B2Dec 20, 2022
Buffer layer in memory cell to prevent metal redeposition
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12369503B2Jul 22, 2025
Encapsulated phase change material switch and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12268103B2Apr 1, 2025
Phase change material switch with improved thermal confinement and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12354951B2Jul 8, 2025
Layout for reducing loading at line sockets and/or for increasing overlay tolerance while cutting lines
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US11404480B2Aug 2, 2022
Memory arrays including continuous line-shaped random access memory strips and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations45