Inventor

HSU CHENG-CHIEH

TW5 patents

⚠️ This page may combine multiple inventors who share the name “HSU CHENG-CHIEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FIRST INT COMPUTER INC

1 patent

US6215180B1Apr 10, 2001

Dual-sided heat dissipating structure for integrated circuit package

FIRST INT COMPUTER INC141 citations94

(unassigned)

1 patent

US6130477AOct 10, 2000

Thin enhanced TAB BGA package having improved heat dissipation

55 citations91

CYNTEC CO LTD

1 patent

US7405467B2Jul 29, 2008

Power module package structure

CYNTEC CO LTD15 citations83

EDISON OPTO CORP

1 patent

US7896690B1Mar 1, 2011

Electrical connection device

EDISON OPTO CORP2 citations59

ECONET HK LTD

1 patent

US11258252B2Feb 22, 2022

On-chip surge protection circuit

ECONET HK LTD0 citations54