Inventor
KIM YOUNGLYONG
KR16 patents
Patents
16 patentsUS12237290B2Feb 25, 2025
Semiconductor packages and methods of manufacturing the semiconductor packages
SAMSUNG ELECTRONICS CO LTD2 citations72
US11222882B2Jan 11, 2022
Semiconductor package including dummy chip on a first semiconductor chip and laterally spaced apart from a second semiconductor chip
SAMSUNG ELECTRONICS CO LTD2 citations71
US11164805B2Nov 2, 2021
Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon
SAMSUNG ELECTRONICS CO LTD4 citations71
US11581234B2Feb 14, 2023
Semiconductor package with improved heat dissipation
SAMSUNG ELECTRONICS CO LTD2 citations70
US12033973B2Jul 9, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations69
US11817443B2Nov 14, 2023
Semiconductor package including a first semiconductor chip with a plurality of first chip pads directly bonded to a plurality of second chip pads of an upper semiconductor chip
SAMSUNG ELECTRONICS CO LTD1 citations61
US12341074B2Jun 24, 2025
Semiconductor package with increased thermal dissipation
SAMSUNG ELECTRONICS CO LTD0 citations60
US11676875B2Jun 13, 2023
Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon
SAMSUNG ELECTRONICS CO LTD0 citations60
US12568868B2Mar 3, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations58
US12582009B2Mar 17, 2026
Semiconductor package including pads
SAMSUNG ELECTRONICS CO LTD0 citations51
US12525585B2Jan 13, 2026
Semiconductor package including sub-package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12512446B2Dec 30, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12476179B2Nov 18, 2025
Semiconductor package including through-silicon via and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12166013B2Dec 10, 2024
Semiconductor package, and a package on package type semiconductor package having the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US11488937B2Nov 1, 2022
Semiconductor package with stack structure and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US8922007B2Dec 30, 2014
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations40