Inventor
HWANG INHYO
KR11 patents
Patents
11 patentsUS11329032B2May 10, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations71
US12388024B2Aug 12, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12218100B2Feb 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12033948B2Jul 9, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11784171B2Oct 10, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations60
US12598758B2Apr 7, 2026
Semiconductor device including dummy pad
SAMSUNG ELECTRONICS CO LTD0 citations51
US12446237B2Oct 14, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US12159858B2Dec 3, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12543600B2Feb 3, 2026
Memory device
SAMSUNG ELECTRONICS CO LTD0 citations50
US12512446B2Dec 30, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12476179B2Nov 18, 2025
Semiconductor package including through-silicon via and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations50