Inventor
OIE MANABU
JP5 patents
Patents
5 patentsUS10157784B2Dec 18, 2018
Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization
TOKYO ELECTRON LTD4 citations71
US9607888B2Mar 28, 2017
Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling
TOKYO ELECTRON LTD2 citations71
US12300467B2May 13, 2025
Plasma processing method and plasma processing apparatus
TOKYO ELECTRON LTD0 citations59
US11742228B2Aug 29, 2023
Substrate processing method and substrate processing system
TOKYO ELECTRON LTD0 citations53
US11899476B2Feb 13, 2024
Method and apparatus for measuring gas flow
TOKYO ELECTRON LTD0 citations45