Inventor

MATTHEWS JAMES A

US42 patents

⚠️ This page may combine multiple inventors who share the name “MATTHEWS JAMES A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATTHEWS JAMES A

MICROUNITY SYSTEMS ENG

Method of fabricating a heat exchanger for solid-state electronic devices

Heat exchanger for solid-state electronic devices

Masks for improved lithographic patterning for off-axis illumination lithography

Mask for photolithography

Method for improved lithographic patterning in a semiconductor fabrication process

Method of fabricating a heat exchanger for solid-state electronic devices

Heat exchanger for solid-state electronic devices

Process for fabricating polysilicon resistors and interconnects

Lithographical mask for controlling the dimensions of resist patterns

Bipolar junction exhibiting suppressed kirk effect

Process for fabricating BICMOS with hypershallow junctions

Bicmos process utilizing planarization technique

Method of making hall effect semiconductor memory cell

Hall effect semiconductor memory cell

BiCMOS logic gate having linearly operated load FETs

BiCMOS logic gate having plural linearly operated load FETs

Bipolar junction transistor exhibiting improved beta punch-through characteristics

Method of forming self-aligned contacts in a semiconductor process

Planarization method for fabricating high density semiconductor devices

Spatial optical modulator

AGILENT TECHNOLOGIES INC

Wafer-level packaging of optical receivers

Optical receiver package

Surface emitting laser package having integrated optical element and alignment post

Fiber optic connectors and methods of making the same

INTEL CORP

Process for forming self-aligned complementary source/drain regions for MOS transistors

Method for fabricating CMOS devices with guardband

CMOS Process with unique plasma etching step

AVAGO TECH FIBER IP SG PTE LTD

Surface emitting laser package having integrated optical element and alignment post

Optical device package with turning mirror and alignment post

Lids for wafer-scale optoelectronic packages

(unassigned)

Heat bond seaming tape and method of manufacture

Heat bond seaming tape and method of manufacture

PACIFIC ADVANCED CIVIL ENGINEE

Modular wastewater treatment system

Modular wastewater treatment system

MICRO UNITY SYSTEMS ENGINEERIN

Non-volatile memory cell

MICRUNITY SYSTEMS ENG

Process for forming planarized, air-bridge interconnects on a semiconductor substrate

MICROSYSTEMS ENG INC

Method for fabricating a bipolar junction transistor exhibiting improved beta and punch-through characteristics

MICROUNIT SYSTEMS ENGINEERING

Process for flip-chip bonding a semiconductor die having gold bump electrodes

GALLUP KENDRA J

Lids for wafer-scale optoelectronic packages

RYOBI MOTOR PRODUCTS CORP

Vacuum cleaner upper hose assembly

AVAGO TECHNOLOGIES GENERAL IP

Optoelectronic device packaging assemblies and methods of making the same

MCCOLLOCH LAWRENCE R

Optoelectronic device packaging assemblies and methods of making the same